Inserting And Removing Devices; Inserting The I/O Module; Figure 7: Insert I/O Module (Example) - WAGO 750-486/040-000 Manual

46 Mounting
5.2

Inserting and Removing Devices

Do not touch hot surfaces!
The surface of the housing can become hot during operation. If the device was
operated at high ambient temperatures, allow it to cool off before touching it.
Perform work on devices only if they are de-energized!
Working on energized devices can damage them. Therefore, turn off the power
supply before working on the devices.
Temperature range applies to normal operation!
XTR I/O modules may be operated below −20 °C, but not wired and/or
reconnected.
5.2.1

Inserting the I/O Module

1. Position the I/O module so that the tongue and groove joints to the fieldbus
coupler/controller or to the previous or possibly subsequent I/O module are
engaged.

Figure 7: Insert I/O Module (Example)

2. Press the I/O module into the assembly until the I/O module snaps into the
carrier rail.
Manual
Version 1.0.0
WAGO-I/O-SYSTEM 750 XTR
750-486/040-000 4AI 0/4-20mA NE43 Ex i XTR