Inserting And Removing Devices; Inserting The I/O Module; Figure 6: Insert I/O Module (Example) - WAGO 750-1605/040-000 Manual

30 Mounting
4.2

Inserting and Removing Devices

Do not touch hot surfaces!
The surface of the housing can become hot during operation. If the device was
operated at high ambient temperatures, allow it to cool off before touching it.
Do not work when devices are energized!
High voltage can cause electric shock or burns.
Switch off all power to the device prior to performing any installation, repair or
maintenance work.
Temperature range applies to normal operation!
XTR I/O modules may be operated below −20 °C, but not wired and/or
reconnected.
4.2.1

Inserting the I/O Module

1. Position the I/O module so that the tongue and groove joints to the fieldbus
coupler/controller or to the previous or possibly subsequent I/O module are
engaged.

Figure 6: Insert I/O Module (Example)

2. Press the I/O module into the assembly until the I/O module snaps into the
carrier rail.
Manual
Version 1.3.0
750-1605/040-000 Potential Distribution 16*24V XTR
WAGO-I/O-SYSTEM 750 XTR