FALCOM JP7-T Series Hardware Description page 44

GPS-RECEIVER JP7-T
Recommended soldering reflow profile for JP-T family mounting on PCB
250
200
150
100
50
Figure 15: Typical solder conditions (temperature profile, reflow conditions).
Consider for a long time in the soldering zone (with temperature higher than
180°C) has to be kept as short as possible to prevent component and
substrate damages. Peak temperature must not exceed 240°C. JP7-T family
are able to withstand twice the previous recommended reflow profile in
order to be compatible with a double reflow when SMDs are mounted on
both sides of the PCB. A maximum of two soldering reflows are allowed for
these packages. The use of a no clean flux is highly recommended to avoid
any cleaning operation. In order to prevent any bump cracks, ultrasonic
cleaning methods are not recommended.
This confidential document is the property of FALCOM GmbH and may not be copied or circulated without permission.
3-5 C / sec
°
Preheating
100 sec.
3-9 C / sec
°
200 - 220 sec.
VERSION 1.02
10 sec.
240 C
°
1-5 C / sec
°
Time (sec)
Page 44