Siemens SIMATIC ET 200SP HA System Manual page 152

Technical specifications
9.6 Technical specifications of subcomponents of the ET 200SP HA
Carrier module 8x (6DL1193-6GC00-0NN0)
Article number
General information
Product type designation
Product function
● I&M data
Potential separation
between backplane bus and supply voltage
between the potential groups
Isolation
Isolation tested with
Ambient conditions
Ambient temperature during operation
● horizontal installation, min.
● horizontal installation, max.
● vertical installation, min.
● vertical installation, max.
Dimensions
Width
Height
Depth
Weights
Weight, approx.
152
6DL1193-6GC00-0NN0
Carrier module 8 times
Yes; Asset data
Yes; 4 200 V DC/1 min, type test
Yes; 3 510 V AC/ 5 s, type test (between the power
supply groups; due to isolating distance (in‐
creased isolation) for future ÜK-III requirement of
F technology)
1 500 V DC/1 min, type test (between backplane
bus and functional ground)
-40 °C
70 °C
-40 °C
60 °C
187.5 mm; 180 mm when installed
203 mm
79 mm
450 g
ET 200SP HA Distributed I/O system
System Manual, 08/2019, A5E39261167-AD