Power board 15AP1 with semicunductor modules
1.
Clean the heat sink and apply thermal conducting paste to the semiconductor modules
as described on page 54.
2.
Fit the board and tighten the screws that are securing the IGBT modules to the heat
sink to a torque of 2.5 Nm, and then further tighten them to 4.5 Nm.
WARNING!
Incorrectly fitted components can cause failure. Do not tighten the screws to
more than 4.5 Nm.
3.
Tighten the remaining screws on the circuit board to the torque that is shown in the
picture below.
Note! If capacitors 15C1, 15C2 or transformers 15TM1, 15TM2 have to be replaced,
the power board must be removed and then refitted as described above.
Fitting of circuit board 15AP1
ca41f2heat
- 55 -
S0740 800 196/E101019/P76