Mounting Components On The Heat Sink; Thermal Paste; Rectifier Bridge 2Br1 - ESAB Aristo Mig 3001i Service Manual

Mounting components on the heat sink

Thermal paste

Apply thermal conducting paste to the components before fitting them to the heat sink.
See the spare parts list for the order number for thermal paste. Use only the paste
recommended by us.
1. Start by cleaning the heat sink from dirt and old thermal paste.
2. Apply a very thin, even layer of thermal paste to the contact surfaces of the
components.
The purpose of the paste is to fill out any hollows in the surfaces of the components
and the heat sink. Those parts of the component and the heat sink that are in true
metallic contact may already have good thermal contact.
3. Mount the components as described below.

Rectifier bridge 2BR1

1. Clean the heat sink and apply thermal conducting paste as described above.
2. Fit the bridge and tighten the screws to a torque of 1 Nm, and then further tighten them
to 4.5 Nm.
3. Tighten the screws that connect the bridge to circuit board 2AP1 to 4.5 Nm.
Fitting of rectifier bridge 2BR1 and circuit board 2AP1
ca41f2heat
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S0740 800 196/E101019/P76