Power Board 15Ap1 With Semicunductor Modules - ESAB Origo Mig L3000i Service Manual

8 SERVICE INSTRUCTIONS
8.9.3

Power board 15AP1 with semicunductor modules

1. Clean the heat sink and apply thermal conducting paste to the semiconductor
modules as described in "Mounting components on the heat sink", page 95.
2. Fit the board and tighten the screws that are securing the IGBT modules to the
heat sink to a torque of 2.5 Nm, and then further tighten them to 4.5 Nm.
WARNING!
Incorrectly fitted components can cause failure. Do not tighten the
screws to more than 4.5 Nm.
3. Tighten the remaining screws on the circuit board to the torque that is shown in the
picture below.
NOTE!
If capacitors 15C1, 15C2 or transformers 15TM1, 15TM2 have to be
replaced, the power board must be removed and then refitted as
described above.
Fitting of circuit board 15AP1
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