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Intel E7500 Design Manual

Design guide
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Intel
E7500 Chipset
Design Guide
E7500 Memory Controller Hub (MCH) Thermal and Mechanical
Design Guidelines
February 2002
Document Number:
298647-001

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Summary of Contents for Intel E7500

  • Page 1 ® Intel E7500 Chipset Design Guide E7500 Memory Controller Hub (MCH) Thermal and Mechanical Design Guidelines February 2002 Document Number: 298647-001...
  • Page 2 No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right.

  • Page 3: Table Of Contents

    Thermal Interface Material ..............27 6.3.5 Heatsink Clip ..................27 6.3.6 Clip Retention Anchors................28 6.3.7 Board Level Component Keep-out Dimensions ........28 Reliability Requirements ..................30 Appendix A: Thermal Solution Component Suppliers ................31 Appendix B: Mechanical Drawings......................33 ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...
  • Page 4 Figure 5. 0° Angle Attach Methodology (Top View)............19 Figure 6. 0° Angle Attach Heatsink Modifications..............19 Figure 7. Thermal Solution Decision Flowchart..............20 ® Figure 8. Reference Heatsink Volumetric Envelope for the Intel MCH......22 Figure 9. Reference Thermal Solution Assembly..............23 Figure 10. Reference Thermal Solution Assembly (Side View).........24 Figure 11.

  • Page 5: Revision History

    Revision History Revision Description Date Number -001 Initial Release. February 2002 ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...
  • Page 6 This page is intentionally left blank. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 7: Introduction

    The goal of this document is to provide an understanding of the operating limits of the ® Intel E7500 chipset MCH and describe a reference thermal solution. Properly designed solutions provide adequate cooling to maintain the MCH die temperatures within thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance.

  • Page 8: Design Flow

    - Thermal Models - Thermal Model Users Guide Step 2: Heatsink Selection - Thermal Reference - Mechanical Reference Step 3: Thermal Validation - Thermal Testing Software - Software Users Guide Therm_Design_Proc ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 9: Definition Of Terms

    The maximum die temperature with the reference thermal solution attached. This die-hs temperature is measured at the geometric center of the top of the package die. Thermal Design Power. Thermal solutions should be designed to dissipate this target power level. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 10: Reference Documents

    Intel PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines 298648 ® ® Intel Xeon™ Processor with 512 KB L2 Cache and Intel E7500 Chipset Platform 298649 Design Guide ® Intel E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) 290730 ®...

  • Page 11: Packaging Technology

    Packaging Technology The E7500 chipset consists of three individual components: E7500 MCH, 82870P2 P64H2, and 82801CA ICH3-S. The E7500 MCH utilizes a 42.5 mm, 6-layer FC-BGA package shown in ® Figure 3 and Figure 2. For information on the P64H2 package, refer to the Intel 82870P2 ®...

  • Page 12: Figure 3. Intel E7500 Mch Package Dimensions (Top View)

    00.200 L C A S B 00.071 L C Metal Edge (n)x 0.790 ± 0.025 (n)x 0.025 Min MCH_Pkg_TopView NOTES: 1. All dimensions are in millimeters. 2. All dimensions and tolerances conform to ANSI Y14.5M–1982. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 13: Thermal Simulation

    Thermal Simulation Thermal Simulation Intel provides thermal simulation models of the MCH and associated user’s guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated system- level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool “FLOTHERM*”...
  • Page 14 Thermal Simulation This page is intentionally left blank. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 15: Thermal Specifications

    Thermal Specifications Power See Table 1 for TDP specifications for the E7500 MCH. FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without thermal solutions. Intel recommends that system designers plan for one or more heatsinks when using the E7500 chipset.
  • Page 16 Thermal Specifications This page is intentionally left blank. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 17: Thermal Metrology

    The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring the MCH die temperature. Section 5.1 provides guidelines on how to accurately measure the MCH die temperatures.

  • Page 18: Angle Attach Methodology

    It is critical that the thermocouple bead makes contact with the die (see Figure 5). Attach heatsink assembly to the MCH, and route thermocouple wires out through the milled slot. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 19: Figure 5. 0° Angle Attach Methodology (Top View)

    Figure 6. 0° Angle Attach Heatsink Modifications 1.3 mm (0.05 in.) (0.5 mm (0.02 in.) Depth) 3.3 mm (0.13 in.) Diameter (1.5 mm (0.06 in.) Depth) Angle_Attach_Heatsink_Mod NOTE: Not to scale. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 20: Power Simulation Software

    Intel Xeon™ processor with 512-KB L2 cache and the higher bandwidth capability of the E7500 chipset enables new levels of system performance. To assess the thermal performance of an MCH thermal solution under “worst-case realistic application” conditions, Intel has developed a software utility that operates the chipset at near worst-case power dissipation.

  • Page 21: Reference Thermal Solutions

    Reference Thermal Solutions Reference Thermal Solutions Intel has developed a reference thermal solution designed to meet the cooling needs of the MCH at worst-case conditions. This chapter describes the overall requirements for the reference thermal solution, including critical-to-function dimensions, operating environment, and validation criteria.

  • Page 22: Figure 8. Reference Heatsink Volumetric Envelope For The Intel ® Mch

    Figure 8. Reference Heatsink Volumetric Envelope for the MCH 40 mm (1.6 Keep-out (Tall Above Motherboa 28 mm (1.1 (Short Motherboa 42.5 mm (1.67 42.5 (1.67 42.5 mm (1.67 Heatsink_Volumetric_Envelope NOTE: Not to scale. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 23: Thermal Solution Assembly

    Appendix B. Appendix A contains vendor information for each thermal solution component. Figure 9. Reference Thermal Solution Assembly Anchored Heatsin Mechanical Thermal FC-BGA Solder-Down ref_therm_solution_assy ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 24: Figure 10. Reference Thermal Solution Assembly (Side View)

    Reference Thermal Solutions Figure 10. Reference Thermal Solution Assembly (Side View) Figure 11. Reference Thermal Solution (Top View) Ref_Thermal_Solution ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 25: Heatsink Orientations

    (Figure 12). Aligning the heatsink 45° relative to the airflow is acceptable but delivers reduced thermal performance. Figure 12. Preferred Heatsink Orientation Orthogonal Mean Air Flow Direction Incorrect Orientation Parallel M ean Correct Air Flow Direction heatsk_orient ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 26: Extruded Heatsink Profiles

    6.3.2 Extruded Heatsink Profiles The E7500 chipset reference thermal solution uses an extruded heatsink for cooling the MCH. Figure 13 shows the heatsink profile. This document does not provide tolerance information. Check with your heatsink supplier for specific tolerances. Appendix A lists suppliers for the extruded heatsink.

  • Page 27: Mechanical Interface Material

    6.3.3 Mechanical Interface Material Intel recommends the use of a mechanical interface material to avoid cracking of the exposed die under loading. The interface material reduces mechanical loads experienced by the die. The reference thermal solution uses a picture frame gasket of 0.813 mm (0.032 in.) thick Poron* foam.

  • Page 28: Clip Retention Anchors

    6.3.6 Clip Retention Anchors For E7500 chipset-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45°...

  • Page 29: Figure 17. Retention Mechanism Component Keep-Out Zones

    (0.165) 0.100 Detail A 0.165 0.083 0.038 Plated Through Hole 0.173 0.345 0.200 0.100 2x 0.056 Trace Keepout Component Keepout 850_Keepout_Zone NOTES: 1. Dimensions are in inches. 2. Not to scale. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 30: Reliability Requirements

    The tests should be performed on a sample size of at least 12 assemblies from 3 lots of material. Additional Pass/Fail Criteria may be added at the discretion of the user. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 31: Appendix A: Thermal Solution Component Suppliers

    (503) 693-3509, x235 Foxconn bhall@foxconn.com Dr. Dah-Chyi (DC) Kuo 886-2-2995-2666, x131 kuo@ccic.com.tw Alternate Pin Fin Heatsink Kit A13506-001 (43gm, 42 x 42 x 35 mm) Bob Hall Foxconn (503) 693-3509, x235 bhall@foxconn.com ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 32: Table 5. Interface Materials

    Julia Jiang Solder-Down A13494-005 Foxconn (408) 919-6178 Anchor juliaj@foxconn.com Note: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability. ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

  • Page 33: Appendix B: Mechanical Drawings

    Appendix B: Mechanical Drawings Appendix B: Mechanical Drawings This appendix contains the following drawings: MCH Heatsink Assembly MCH Heatsink Clip ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...
  • Page 34 Appendix B: Mechanical Drawings Figure 18. MCH Heatsink Assembly ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...
  • Page 35 Appendix B: Mechanical Drawings Figure 19. MCH Heatsink Clip ® Intel E7500 MCH Thermal and Mechanical Design Guidelines...

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