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Package characteristics
Figure 28. Recommended PCB design rules (0.80/0.75 mm pitch BGA)
60/67
Dpad
Dsm
Dpad
0.37 mm
0.52 mm typ. (depends on solder
Dsm
mask registration tolerance
Solder paste
0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
STM32F103xx
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