ST STM32F103x6 Manual page 47

STM32F103xx
6 Package characteristics
Figure 27. LFBGA100 - low profile fine pitch ball grid array package outline
Table 42.
Dim.
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
N (number of balls)
Seating plane
C
A2 A4 A3
B
K
J
H
G
F
E
D
C
B
A
A1 corner index area
(see note 5)
LFBGA100 - low profile fine pitch ball grid array package mechanical data
Min
0.270
0.45
9.85
9.85
A1
D
D1
e F
1 2 3 4 5 6 7 8 9 10
∅
b (100 balls)
∅
eee
M
∅
fff
M
Bottom view
mm
Typ Max
1.700
1.085
0.30
0.80
0.50 0.55
10.00 10.15
7.20
10.00 10.15
7.20
0.80
1.40
0.12
0.15
0.08
100
Package characteristics
ddd C
A
A
F
E
E1
e
C A B
C
ai14396
inches
Min Typ
0.011
0.043
0.012
0.018 0.020
0.388 0.394
0.283
0.388 0.394
0.283
0.031
0.055
Max
0.067
0.031
0.022
0.40
0.40
0.005
0.006
0.003
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