IBM iSeries 270 Service Manual page 89

No card positions in the CEC permit concurrent maintenance. You must power down the system to
exchange a card. See Models 840/SB3, FC 8079-001 (lower half), FC 9079 Cards (dedicated).
For FC 9079 I/O tower IXS cards:
The IXS cards require dedicated maintenance. See Models 840/SB3, FC 8079-001 (lower half), FC 9079
Cards (dedicated).
For the FC 9079 I/O tower cards (except IXS cards), or FC 8079-001 I/O tower cards:
v Card positions C01 through C07 and C09 through C15 permit concurrent maintenance using HSM. You
can power down the individual card slot, but you cannot power down the tower.
v If the resource is the load source IOA or the load source IOP, or any other storage IOA/IOP with critical
DASD attached for the system, primary, or secondary partition, follow the on-screen instructions when
you use HSM to power down the IOP or IOA. Instructions to use functions 68 and 69 on the control
panel will be included.
v If the resource is the console IOA or the console IOP for the system or primary partition, you cannot
power down the domain.
v If the resource is the console IOA or the console IOP for a secondary partition, then power down the
secondary partition and follow the procedure from the primary partition.
v All other card positions require dedicated maintenance. See Models 840/SB3, FC 8079-001 (lower half),
FC 9079 Cards (dedicated).
CAUTION:
The circuit card contains lead solder. To avoid the release of lead (Pb) into the environment, do not
burn. Discard the circuit card as instructed by local regulations. (RSFTC234)
Attention: All cards are sensitive to electrostatic discharge (see Work with electrostatic discharge-sensitive
parts).
To remove or replace cards (concurrently):
1. From the Hardware Service Manager display, select Packaging hardware resources.
2. Select Hardware contained in packaging for the frame ID that you are working on.
3. Find the card position for the IOA or IOP that you are removing and select Concurrent maintenance.
Attention: If multiple resources are shown with the same card position, one or more of these
resources will show a status of Missing ("?" after the description). Only one resource will be listed as
not missing. Select this resource for the concurrent maintenance operation.
4. A listing of the power domain is shown. Find the IOA or IOP that you are removing and select Power
off domain. Everything within the IOA's or IOP's power domain will be powered off .
5. To see the status of the power domain, select Display power status.
6. Find the IOA or IOP that you are removing and select Toggle LED blink off/on.
7. Remove the cover to access the card that you are removing from the system. See Models 840/SB3 -
Covers.
8. Look at the power LED for the card that you are removing to ensure that it is powered off. The power
LED is located above or in front of the card slot. If the LED is blinking multiple times per second
(rapidly) or it is off, then the card is powered off.
9. You are removing a card in the lower half of the FC 8079-001 or the 9079 I/O tower using
concurrent maintenance. From the rear of the tower perform the following:
a. Open the rear cover. See Models 840/SB3 - Covers.
b. Remove the EMC access plate that is located directly above the card enclosure. Press the two
latching mechanisms together and tilt the top of the cover away from the frame to remove it. See
Final assembly, rear - Models 840 and SB3 processor tower.
Analyze hardware problems
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