IBM iSeries 270 Service Manual page 242

Position FRU name
MB1 System unit
backplane
D01 to D06 Disk unit
D07 Optical device
D08 Tape unit
P01 Power supply
B01, B02 AMD
NB1 Control panel
R01 Processor power
regulator
DB1, DB2, Device board
DB3
230
Hardware (Remove and Replace; Part Locations and Listings)
Type, CCIN, or part
number (use the
Type, model, and
part number list to
determine the part
number when the
Possible failing type or CCIN are
component given.)
2249 (See page 521)
v Card
enclosure or
Note: Embedded IOP
backplane
(type 284D) is
v Clock card
exchanged with the
v SPCN card system unit backplane.
v HSL I/O
OR
bridge
v Processor
224A (See page 521)
regulator
Note: Embedded IOP
v Memory riser
(type 286F) is
card
exchanged with the
v System unit
system unit backplane.
backplane
v HSL ring
connection
v HSL controller
v Processor
v Service
processor
v IOP
v Multi-adapter
bridge (all)
Disk unit See the Type, model,
and part number list.
Optical device See the Type, model,
and part number list.
Tape unit See the Type, model,
and part number list.
Power supply See Final assembly —
Models 270, 800, and
810.
Air moving See Final assembly —
device (AMD) Models 270, 800, and
810.
Control panel 247D (See page 523)
Processor power 04N4276
regulator
Device board See the Type, model,
and part number list.
Remove and replace/recovery
procedure
Go to Models 270, 800, and 810 -
System unit backplane - MB1.
Go to Recovery procedures.
Go to Models 270, 800, and 810 -
Removable media - D07 and D08.
Go to Models 270, 800, and 810 -
Removable media - D07 and D08.
Go to Models 270, 800, and 810 - Power
supply - P01
Go to Models 270, 800, and 810 - Air
moving device - B01 and B02.
Go to Models 270, 800, and 810 -
Control panel - NB1.
Go to Models 270, 800, and 810 -
Processor regulator - R01
Go to Models 270, 800, and 810 -
Device board - DB1, DB2, and DB3