IBM iSeries 270 Service Manual page 255

Position FRU name
C07 PCI card
MB1 System unit
backplane
D01 to D06 Disk unit
D07 Optical device
D08 Tape unit
P01 Power supply
B01, B02 AMD
NB1 Control panel
DB1 Device board
M01 Memory Riser Card
Type, CCIN, or part
number (use the
Type, model, and
part number list to
determine the part
number when the
Possible failing type or CCIN are
component given.)
IOA See the Type, model,
and part number list.
282F (See page 526)
1. Service processor
2. IOP
Note: Embedded IOP
3. Card enclosure or (type 284E) is
backplane exchanged with the
system unit
4. Clock card
backplane, 282F.
5. SPCN card
6. HSL I/O bridge
7. System unit
backplane
8. HSL ring
connection
9. Multi-adapter
bridge (all)
Disk unit See the Type, model,
and part number list.
Optical device See the Type, model,
and part number list.
Tape unit See the Type, model,
and part number list.
Power supply 24L1402
Air moving device See Final assembly
(AMD) — Models 270, 800,
and 810.
Control panel 247D (See page 523) Go to Models 270,
Device board 28CD (See page 528) Go to Models 270,
Memory Riser Card 2884 (See page 527)
Remove and
replace/recovery
procedure
Go to Models 270,
800, and 810 - Cards
- Concurrent.
Go to Models 270,
800, and 810 -
System unit
backplane - MB1
Go to Recovery
procedures.
Go to Models 270,
800, and 810 -
Removable media -
D07 and D08.
Go to Models 270,
800, and 810 -
Removable media -
D07 and D08.
Go to Models 270,
800, and 810 - Power
supply - P01
Go to Models 270,
800, and 810 - Air
moving device - B01
and B02
800, and 810 -
Control panel - NB1
800, and 810 - Device
board - DB1, DB2,
and DB3
Go to Models 270,
800, and 810 - Cards
(dedicated)
Analyze hardware problems
243