IBM iSeries 270 Service Manual page 271

Sb2 and sb3 hardware
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Possible failing
component
v System memory
v Memory card
Disk unit
Tape unit
Optical device
Air moving device (AMD) AMD
Power supply
Control panel
Device board
Device board
Time of day battery
Memory configuration
FRU name
Position
Memory card
A through H on
each processor/
memory card
Disk unit
D01 through
D15
Tape unit
D17
Optical device
D18
B01, B02
Power supply
P01, P02
Control panel
NB1
Device board
DB1
Device board
DB2, DB3, and
DB4
Time of day
CB1 - opposite
battery
from C02 card
slot
Type or
CCIN
number
(see the
Type,
model, and
Remove and
part number
replace
list)
procedure
3042 (See
Go to Model 825 -
page 529),
Memory - A
3043 (See
through H
page 529),
3045, 3044
(See page
529), 3046
(See page
529)
See the
Go to Model 825 -
Type, model,
Disk unit
and part
(concurrent)
number list
See the
Go to Model 825 -
Type, model,
Removable media
and part
- D17 and D18
number list
See the
Go to Model 825 -
Type, model,
Removable media
and part
- D17 and D18
number list
See Final
Go to Model 825 -
assembly -
Air moving device
Model 825
(AMD) - B01; B02
(concurrent)
See Final
Go to Model 825 -
assembly -
Power supply -
Model 825
P01 and P02
250A (See
Go to Model 825 -
page 523)
Control panel -
NB1
See the
Go to Model 825 -
Type, model,
Device board -
and part
DB1
number list.
See the
Go to Model 825 -
Type, model,
Device board -
and part
DB2, DB3, and
number list.
DB4
See the
Go to Model 825 -
Type, model,
Time of day
and part
battery
number list.
Analyze hardware problems
Additional
comments
259

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