IBM iSeries 270 Service Manual page 151

Sb2 and sb3 hardware
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use concurrent maintenance on a partitioned system, follow the procedures from the partition that owns
the resource. If the resource is not owned, follow the procedure from the primary partition.
For FC 5074, FC 5079, FC 5094, or FC 5294 IXS cards:
The IXS cards require dedicated maintenance. Do NOT power down the individual card slot. You can
power down the FC 5074 tower, or the top or bottom half of an FC 5079 or FC 5294 tower. See FC 5074,
FC 5079, FC 5094, FC 5294 - Cards (dedicated)
For FC 5074, FC 5079, FC 5094, or FC 5294 cards - except IXS cards:
v Card positions that permit card level concurrent maintenance using HSM:
– For FC 5074 or FC 5079: Card positions C01 through C07 and C09 through C15 permit card level
concurrent maintenance using HSM. You can power down the individual card slot.
– For FC 5094 or FC 5294: Card positions C01 through C09, and C11 through C15 permit card level
concurrent maintenance using HSM. You can power down the individual card slot.
v If the resource is the load source IOA or the load source IOP, or any other storage IOA/IOP with critical
DASD attached for the system, primary, or secondary partition, follow the on-screen instructions when
you use HSM to power down the IOP or IOA. Instructions to use functions 68 and 69 on the control
panel will be included.
v If the resource is the console IOA or the console IOP for the system or primary partition, you cannot
power down the domain.
v If the resource is the console IOA or the console IOP for a secondary partition, then power down the
secondary partition and follow the procedure from the primary partition.
CAUTION:
The circuit card contains lead solder. To avoid the release of lead (Pb) into the environment, do not
burn. Discard the circuit card as instructed by local regulations. (RSFTC234)
Attention: All cards are sensitive to electrostatic discharge (see Work with electrostatic discharge-sensitive
parts).
To remove cards concurrently:
1. On the command line, enter the Start System Service Tools command:
STRSST
If you cannot get to SST, select DST (see Accessing Dedicated Service Tools (DST) in the iSeries
Service Functions
book).
Attention: Do not perform a system IPL to get to DST.
2. Select Start a Service Tool —> Hardware Service Manager —> Packaging hardware resources.
3. Select Hardware contained within package for the Frame ID that contains the IOA or IOP that you
are removing.
4. Find the card position for the IOA or IOP that you are removing and select Concurrent maintenance.
5. A listing of the power domain is shown. Select the Power off domain function key. Everything within
the IOA's or IOP's power domain will be powered off .
6. To see the status of the power domain, select the Display power states function key.
7. Find the IOA or IOP that you are removing and select Toggle LED blink off/on.
8. Remove the cover to access the card that you are removing from the system. See FC 5074, FC
5079, FC 5094, FC 5294, FC 9079, FC 9094 - Covers.
Analyze hardware problems
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