Additional Suppliers - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Thermal/mechanical design guidelines
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Table F-1.
Suppliers for the Quad-Core Intel
Intel Reference Solution (Sheet 2 of 2)
Assembly
Component
CEK771-01-1U
CEK Heatsink
(for 1U)
Intel p/n C90546
rev02
Thermal Interface
Material
CEK Spring for
CEK771
CEK771-02-1U
1U Alternative
Heatsink
(for 1U)
Intel p/n D71537
Rev 02
Thermal Interface
Material
CEK Spring for
CEK771
Note:
CEK771-02-1U is the 1U alternative reference heatsink design for Quad-Core Intel® Xeon® Processor E5300 Series and
Quad-Core Intel® Xeon® Processor L5300 Series in volumetrically constrained form factors.
F.1.2

Additional Suppliers

The Intel enabled solutions for Quad-Core Intel
preliminary. The Intel enabled solutions have not been verified to meet the criteria
outlined in
components from the suppliers listed in
For additional details, please refer to the Quad-Core Intel
Series thermal mechanical enabling components drawings in
98
Description
Copper Fin, Copper
Base
See CEK771-01-2U
See CEK771-01-2U
Aluminum
Extrusion
See CEK771-01-2U
See CEK771-01-2U
Appendix
E. Customers can purchase the Intel enabled thermal solution
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines
®
®
Xeon
Processor 5300 Series
Development
Suppliers
Fujikura
Fujikura America
CNDA# 1242012
Ash Ooe
(stacked fin)
a_ooe@fujikura.com
408-748-6991
Fujikura Taiwan Branch
Yao-Hsien Huang
yeohsien@fujikuratw.com.tw
886(2)8788-4959
Asia Vital
David Chao
Components
david_chao@avc.com.tw
+886 (2) 2299-6930 x7619
(AVC)
CNDA# AP5281
®
®
Xeon
Processor 5300 Series are
Table
F-1and
Table
F-2.
®
Enabled Suppliers Information
Supplier Contact Info
®
Xeon
Processor 5300
Appendix
B.

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