Thermal Profile Adherence; Cek Heatsink Thermal Performance - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Thermal/Mechanical Reference Design
Figure 2-18. 1U CEK Heatsink Thermal Performance
2.4.6

Thermal Profile Adherence

The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A
for the Quad-Core Intel® Xeon® Processor X5300 Series. From
sigma (mean+3sigma) performance of the thermal solution is computed to be
0.190 °C/W and the processor local ambient temperature (T
is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-8.y = 0.190x + 40
where,
y = Processor T
x = Processor power value (W)
Figure 2-19
Profile to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A
specification. The 2U+ CEK solution meets the Thermal Profile A with a 1.7 °C margin
at the lower end (P_PROFILE_MIN) and 0.2 °C margin at the upper end (TDP). By
designing to Thermal Profile A, it is ensured that no measurable performance loss due
to TCC activation is observed under the given environmental conditions.
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
value (°C)
CASE
below shows the comparison of this reference thermal solution's Thermal
Table 2-4, the three-
) for this thermal solution
LA
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