Performance Targets - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet or
Section 2.2.8
of this document also provides details on the 2U+ and 1U Intel reference thermal
solutions that are designed to meet the Quad-Core Intel® Xeon® Processor X5300
Series Thermal Profile A and Thermal Profile B respectively.
2.2.7.2 Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor
E5300/L5300 Series
The Quad-Core Intel® Xeon® Processor E5300/L5300 Series is designed to go into
various form factors, including the volumetrically constrained 1U and custom blade
form factors.
Designing to the Thermal Profile ensures that no measurable performance loss due to
Thermal Control Circuit (TCC) activation is observed in the processor. It is expected
that TCC would only be activated for very brief periods of time when running a worst-
case real world application in a worst-case thermal condition. These brief instances of
TCC activation are not expected to impact the performance of the processor. A worst
case real world application is defined as a commercially available, useful application
which dissipates a power equal to, or above, the TDP for a thermally relevant
timeframe. One example of a worst-case thermal condition is when a processor local
ambient temperature is at or above 42.6°C for Quad-Core Intel® Xeon® Processor
E5300 Series Thermal Profile.
Thermal solutions that exceed the Thermal Profile specification are considered
incompliant and will adversely affect the long-term reliability of the processor.
Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet or
Section 2.2.8
specifications.
reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon®
Processor E5300/L5300 Series Thermal Profile.
2.2.8

Performance Targets

The Thermal Profile specifications for this processor are published in the Quad-Core
Intel® Xeon® Processor 5300 Series Datasheet. These Thermal Profile specifications
are shown as a reference in the subsequent discussions.
28
for the Thermal Profile A and Thermal Profile B specifications.
for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Profile
Section 2.4 and Section A
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Thermal/Mechanical Reference Design
of this document provide details on 1U Intel
Section 2.4