Definition Of Terms; Terms And Descriptions - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Table 1-1. Reference Documents (Sheet 2 of 2)
Platform Environment Control Interface(PECI) Specification
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
Quad-Core Intel® Xeon® Processor 5300
Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and
ProE* format)
Quad-Core Intel® Xeon® Processor 5300
Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*)
Quad-Core Intel® Xeon® Processor 5300
Series_Package_Thermal_Models (in Flotherm* and Icepak*)
Conroe and Woodcrest Processor Family BIOS Writer's Guide (BWG)
Thin Electronics Bay Specification (A Server System Infrastructure (SSI)
Specification for Rack Optimized Servers
Note: Contact your Intel field sales representative for the latest revision and order number of this document.
1.4

Definition of Terms

Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term
Bypass
DTS
MSR
FMB
FSC
IHS
LGA771 Socket
P
MAX
PECI
Ψ
CA
Ψ
CS
Ψ
SA
T
CASE
10
Document
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
Digital Thermal Sensor replaces the Tdiode in previous products and uses the same
sensor as the PROCHOT# sensor to indicate the on-die temperature. The temperature
value represents the number of degrees below the TCC activation temperature.
The processor provides a variety of model specific registers that are used to control and
report on processor performance. Virtually all MSRs handle system related functions and
are not accessible to an application program.
Flexible Motherboard Guideline: an estimate of the maximum value of a processor
specification over certain time periods. System designers should meet the FMB values to
ensure their systems are compatible with future processor releases.
Fan Speed Control
Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
The Quad-Core Intel® Xeon® Processor 5300 Series interface to the baseboard through
this surface mount, 771 Land socket. See the LGA771 Socket Mechanical Design Guide
for details regarding this socket.
The maximum power dissipated by a semiconductor component.
A proprietary one-wire bus interface that provides a communication channel between
Intel processor and chipset components to external thermal monitoring devices, for use
in fan speed control. PECI communicates readings from the processors Digital Thermal
Sensor. PECI replaces the thermal diode available in previous processors.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
Package Power. Heat source should always be specified for Ψ measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
Package Power.
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
The case temperature of the processor, measured at the geometric center of the topside
of the IHS.
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Comment
See Note following table
See Note following table.
Available electronically
Available electronically
Available electronically
See Note following table.
www.ssiforum.com
Description
CASE
CASE
– T ) / Total Package Power.
S LA
Introduction
– T ) / Total
LA
– T ) / Total
S