Appendix A: Thermal Solution Component Suppliers; Table 4. Complete Thermal Solution Kits; Table 5. Extruded Heatsinks - Intel E7500 Thermal Design Manual
Chipset memory controller hub (mch) thermal and mechanical design guidelines
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Also See for E7500:
- Design manual (35 pages) ,
- Design manual (44 pages) ,
- User manual (54 pages)
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Appendix A: Thermal Solution
Component Suppliers
Table 4. Complete Thermal Solution Kits
Pin Fin Heatsink Kit
(31gm, 42 x 42 x 23 mm)
Alternate Pin Fin Heatsink Kit
(43gm, 42 x 42 x 35 mm)
Table 5. Extruded Heatsinks
Pin Fin Heatsink Kit
(31gm, 42 x 42 x 23 mm)
Alternate Pin Fin Heatsink Kit
(43gm, 42 x 42 x 35 mm)
®
Intel
E7500/E7505 Chipset MCH Thermal Design Guide
Part
Intel Part Number
A69225-001
A69225-002
Part
Intel Part Number
A20930-001
A13506-001
Appendix A: Thermal Solution Component Suppliers
Supplier
CCI/ACK
Foxconn
CCI/ACK
Foxconn
Supplier
CCI/ACK
Foxconn
CCI/ACK
Foxconn
Contact Information
Harry Lin
714-739-5797
hlinack@aol.com
Monica Chih
866-2-29952666x131
monica_chih@ccic.com.tw
Bob Hall
503-693-3509 x235
bhall@foxconn.com
Harry Lin
714-739-5797
hlinack@aol.com
Monica Chih
866-2-29952666x131
monica_chih@ccic.com.tw
Bob Hall
503-693-3509x235
bhall@foxconn.com
Contact Information
Harry Lin
714-739-5797
hlinack@aol.com
Monica Chih
866-2-29952666x131
monica_chih@ccic.com.tw
Bob Hall
503-693-3509x235
bhall@foxconn.com
Harry Lin
714-739-5797
hlinack@aol.com
Monica Chih
866-2-29952666x131
monica_chih@ccic.com.tw
Bob Hall
503-693-3509x235
bhall@foxconn.com
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