Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual page 5

A-4 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®
Processor L5300 Series Thermal Profile ................................................................ 58
B-1 2U CEK Heatsink (Sheet 1 of 4)........................................................................... 60
B-2 2U CEK Heatsink (Sheet 2 of 4)........................................................................... 61
B-3 2U CEK Heatsink (Sheet 3 of 4)........................................................................... 62
B-4 2U CEK Heatsink (Sheet 4 of 4)........................................................................... 63
B-5 CEK Spring (Sheet 1 of 3) .................................................................................. 64
B-6 CEK Spring (Sheet 2 of 3) .................................................................................. 65
B-7 CEK Spring (Sheet 3 of 3) .................................................................................. 66
B-8 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 1 of 6) ............................................................... 67
B-9 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 2 of 6) ............................................................... 68
B-10 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 3 of 6) ............................................................... 69
B-11 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 4 of 6) ............................................................... 70
B-12 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 5 of 6) ............................................................... 71
B-13 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 6 of 6) ............................................................... 72
B-14 1U CEK Heatsink (Sheet 1 of 4)........................................................................... 73
B-15 1U CEK Heatsink (Sheet 2 of 4)........................................................................... 74
B-16 1U CEK Heatsink (Sheet 3 of 4)........................................................................... 75
B-17 1U CEK Heatsink (Sheet 4of 4)............................................................................ 76
B-18 Active CEK Thermal Solution Volumetric (Sheet 1 of 3)........................................... 77
B-19 Active CEK Thermal Solution Volumetric (Sheet 2 of 3)........................................... 78
B-20 Active CEK Thermal Solution Volumetric (Sheet 3 of 3)........................................... 79
B-21 1U Alternative Heatsink (1 of 4) .......................................................................... 80
B-22 1U Alternative Heatsink (2 of 4) .......................................................................... 81
B-23 1U Alternative Heatsink (3 of 4) .......................................................................... 82
B-24 1U Alternative Heatsink (4 of 4) .......................................................................... 83
C-1 Load Cell Installation in Machined Heatsink Base Pocket - Bottom View..................... 86
C-2 Load Cell Installation in Machined Heatsink Base Pocket - Side View......................... 87
C-3 Preload Test Configuration.................................................................................. 87
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5