Components Overview; Cek Thermal Adherence To Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Thermal/Mechanical Reference Design
Figure 2-22. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300
Series Thermal Profile
60
55
50
45
40
Note: Intel has also developed an 1U alternative reference heatsink design. This
alternative heatsink design meets the thermal profile specifications of the
Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel®
Xeon® Processor L5300 Series and offers the advantages of weight reduction
and cost savings in using this alternative 1U heatsink. Refer to
detailed information.
2.4.7

Components Overview

2.4.7.1 Heatsink with Captive Screws and Standoffs
The CEK reference heatsink uses snapped-fin technology for its design. It consists of a
copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The
mounting screws and standoffs are also made captive to the heatsink base for ease of
handling and assembly as shown in
heatsinks, respectively.
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
T @ TDP
CASE_MAX
T @ P
CASE_MAX
_PROFILE_MIN
0 5
15
10
Thermal Profile
Y=0.360*X+42
1U CEK Reference Solution
Y=0.249*X+40
20
25 30 35
P
_ PROFILE _MIN
Figure 2-23 and Figure 2-24
50
40 45
TDP
Power (W)
Appendix A
for the 2U+ and 1U
for
47