Cek Thermal Adherence To Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Figure 2-21. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300
Series Thermal Profile
65
60
55
50
45
40
0
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for
the Quad-Core Intel® Xeon® Processor L5300 Series in volumetrically constrained
form factors. From
thermal solution is computed to be 0.249 °C/W and the processor local ambient
temperature (T
equation for this thermal solution is calculated as:
Equation 2-11.y = 0.249x + 40
where,
y = Processor T
x = Processor power value (W)
Figure 2-22
Profile to the Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile
specification. The 1U CEK solution meets the Thermal Profile with 4.5 °C margin at the
lower end (P
Thermal Profile, it is ensured that no measurable performance loss due to TCC
activation is observed under the given environmental conditions.
46
T @ TDP
CASE_MAX
Y=0.293*X+42.6
T @ P
CASE_MAX
_PROFILE_MIN
5
15 20
10 25
Table 2-6 the three-sigma (mean+3sigma) performance of the
) for this thermal solution is 40 °C. Hence, the Thermal Profile
LA
value (°C)
CASE
below shows the comparison of this reference thermal solution's Thermal
) and 7.5°C margin at the upper end (TDP). By designing to
_PROFILE_MIN
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Thermal/Mechanical Reference Design
Thermal Profile
50
30 35 40 45
Power (W)
P
_ PROFILE _MIN
1U CEK Reference Solution
Y=0.249*X+40
75
70
55 60 65
TDP
80