Quad-Core Intel® Xeon® Processor 5300 Series Package - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package
The Quad-Core Intel® Xeon® Processor 5300 Series is packaged using the flip-chip
land grid array (FC-LGA6) package technology. Please refer to the Quad-Core Intel®
Xeon® Processor 5300 Series Datasheet for detailed mechanical specifications. The
Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in
Figure 2-1,
Core Intel® Xeon® Processor 5300 Series. The stackup height of the processors in the
socket is shown in
processor Datasheet, should there be any conflicts. Integrated package/socket stackup
height information is provided in the LGA771 Socket Mechanical Design Guide.
The package includes an integrated heat spreader (IHS). The IHS transfers the non-
uniform heat from the die to the top of the IHS, out of which the heat flux is more
uniform and spreads over a larger surface area (not the entire IHS area). This allows
more efficient heat transfer out of the package to an attached cooling device. The IHS
is designed to be the interface for contacting a heatsink. Details can be found in the
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet.
The processor connects to the baseboard through a 771-land surface mount socket. A
description of the socket can be found in the LGA771 Socket Mechanical Design Guide.
The processor package and socket have mechanical load limits that are specified in the
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket
Mechanical Design Guide. These load limits should not be exceeded during heatsink
installation, removal, mechanical stress testing, or standard shipping conditions. For
example, when a compressive static load is necessary to ensure thermal performance
of the Thermal Interface Material (TIM) between the heatsink base and the IHS, it
should not exceed the corresponding specification given in the LGA771 Socket
Mechanical Design Guide.
The heatsink mass can also add additional dynamic compressive load to the package
during a mechanical shock event. Amplification factors due to the impact force during
shock must be taken into account in dynamic load calculations. The total combination
of dynamic and static compressive load should not then exceed the processor/socket
compressive dynamic load specified in the LGA771 Socket Mechanical Design Guide
during a vertical shock. It is not recommended to use any portion of the processor
substrate as a mechanical reference or load-bearing surface in either static or dynamic
compressive load conditions.
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Figure 2-2 and Figure 2-3
Appendix B. The drawing is superseded with the drawing in the
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Thermal/Mechanical Reference Design
provide the mechanical information for Quad-