Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual page 54

Thermal/mechanical design guidelines
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The other items listed in
shipped with either the chassis or boards. They are as follows:
• CEK Spring (supplied by baseboard vendors)
• Heatsink standoffs (supplied by chassis vendors)
54
Figure 2-16
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Thermal/Mechanical Reference Design
that are required to complete this solution will be
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