A 1U Alternative Heatsink Thermal/Mechanical Design; Component Overview; Isometric View Of The 1U Alternative Heatsink; A.1 Component Overview - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

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1U Alternative Heatsink Thermal/Mechanical Design

1U Alternative Heatsink

Thermal/Mechanical Design

Intel has also developed an 1U alternative reference heatsink design for the

volumetrically constrained form factor and targeted for the rack optimized and ultra

dense SKUs. This alternative heatsink design meets the thermal profile specifications of

the Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon®

Processor L5300 Series and offers the advantages of weight reduction and cost savings

in using this alternative 1U heatsink.

This section describes the alternative heatsink thermal performance and adherence to

Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon®

Processor L5300 Series thermal profile specifications.

A.1

The alternative 1U reference heatsink is an extruded aluminum heatsink and shares the

same volumetric footprint as the 1U CEK heatsink. It reuses Intel 1U CEK Captive

standoff/screws, Thermal Interface Material (TIM) and Spring.

Figure A-1

Figure A-1. Isometric View of the 1U Alternative Heatsink

Note:

Refer to

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

shows the isometric view of the 1U alternative heatsink.

Appendix B

for more detailed mechanical drawings of the heatsink.

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