Thermal Profile; Thermal Profile Diagram - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

2.2.5

Thermal Profile

The thermal profile is a linear line that defines the relationship between a processor's
case temperature and its power consumption as shown in
the thermal profile is defined as:
Equation 2-1.y = ax + b
Where:
y
x
a
b
Figure 2-7.

Thermal Profile Diagram

T T MAX@ MAX@
CASE CASE
P P
_PROFILE_MIN _PROFILE_MIN
The high end point of the Thermal Profile represents the processor's TDP and the
associated maximum case temperature (T
Thermal Profile represents the power value (P
temperature (T
T
CONTROL
to-ambient resistance of the thermal solution with the y-intercept being the local
processor ambient temperature. The slope of the Thermal Profile is constant between
P
_PROFILE_MIN
the Thermal Profile will require the same heatsink case-to-ambient resistance.
In order to satisfy the Thermal Profile specification, a thermal solution must be at or
below the Thermal Profile line for the given processor when its DTS temperature is
greater than T
customers to make a trade-off between the thermal solution case-to-ambient
resistance and the processor local ambient temperature that best suits their platform
implementation (refer to
solution case-to-ambient resistance and processor local ambient temperature that can
meet a given Thermal Profile. If the case-to-ambient resistance and the local ambient
24
= Processor case temperature, T
= Processor power consumption (W)
= Case-to-ambient thermal resistance, ΨCA (°C/W)
= Processor local ambient temperature, TLA (°C)
T T MAX MAX
CASE CASE
T T
CASE CASE
P P
_PROFILE_MIN _PROFILE_MIN
@ P
CASE_MAX _PROFILE_MIN
(see Section 2.2.6). The slope of the Thermal Profile line represents the case-
and TDP, which indicates that all frequencies of a processor defined by
(refer to Section
CONTROL
Section
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Thermal/Mechanical Reference Design
(°C)
CASE
Thermal Profile Thermal Profile
Power Power
). The lower end point of the
CASE_MAX
_PROFILE_MIN
) for the lowest possible theoretical value of
2.2.6). The Thermal Profile allows the
2.3.3). There can be multiple combinations of thermal
Figure 2-7. The equation of
TDP TDP
) and the associated case