Processor L5300 Series Thermal Profile - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

The 1U alternative thermal solution is designed to meet the Thermal Profile for the
Quad-Core Intel® Xeon® Processor L5300 Series in volumetrically constrained form
factors. From
solution is computed to be 0.325 °C/W and the processor local ambient temperature
(T ) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this
LA
thermal solution is calculated as:
Equation A-2. y = 0.325x + 40
where,
y = Processor T
x = Processor power value (W)
Figure A-4
Profile to the Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile
specification. The 1U alternative solution meets the Thermal Profile with 2.8°C margin
at the lower end (P
designing to Thermal Profile, it is ensured that no measurable performance loss due to
TCC activation is observed under the given environmental conditions.
Figure A-4. 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®

Processor L5300 Series Thermal Profile

60
55
50
45
40
58
Table A-1 the three-sigma (mean+3sigma) performance of the thermal
value (°C)
CASE
below shows the comparison of this reference thermal solution's Thermal
) and 3.7°C margin at the upper end (TDP). By
_PROFILE_MIN
T @ TDP
CASE_MAX
T @ P
CASE_MAX
_PROFILE_MIN
0 5
15
10
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
1U Alternative Heatsink Thermal/Mechanical Design
Thermal Profile
Y=0.360*X+42
1U CEK Reference Solution
Y=0.325*X+40
20
25 30
P
_ PROFILE _MIN
§
50
35 40 45
TDP
Power (W)