Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual page 11

Introduction
Table 1-2. Terms and Descriptions (Sheet 2 of 2)
T _
CASE MAX
TCC
T
CONTROL
T
OFFSET
TDP
Thermal Monitor
Thermal Profile
TIM
T
LA
T
SA
U
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
The maximum case temperature as specified in a component specification.
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
A processor unique value for use in fan speed control mechanisms. T
temperature specification based on a temperature reading from the processor's Digital
Thermal Sensor. T can be described as a trigger point for fan speed control
CONTROL
implementation. T = -T
CONTROL
An offset value from the TCC activation temperature value specified in the processor
data sheet and T =-T
CONTROL OFFSET
during manufacturing and can be obtained by reading the
IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the
Conroe and Woodcrest Processor Family BIOS Writer's Guide (BWG).
Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
A feature on the processor that can keep the processor's die temperature within factory
specifications under normal operating conditions, and with a thermal solution that
satisfies the processor thermal profile specification.
Line that defines case temperature specification of a processor at a given power level.
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, etc.
§
.
OFFSET
. This value is programmed into each processor
is a
CONTROL
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