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4.2.9
How On-Die Thermal Diode, T
Together
The Celeron D Processor in the 775-land LGA package thermal specification is comprised of two
parameters, T
meets the thermal profile. If the system design will incorporate variable speed fan control Intel
recommends monitoring the on-die thermal diode to implement acoustic fan speed control. The
value of on-die thermal diode temperature determines which specification must be met.
4.2.9.1
On-Die Thermal Diode Less than T
If the thermal solution can maintain the thermal diode temperature to less than T
not specified.
4.2.9.2
On-Die Thermal Diode Greater than T
If the on-die thermal diode temperature exceeds T
thermal profile for T
4.3
Acoustic Fan Speed Control
For information on acoustic fan speed control see the Intel
Process in the 775-Land LGA Package Thermal Design Guidelines.
®
®
Intel
Celeron
D Processor in the 775-Land LGA Package Thermal Design Guide29
303730
Order #
and Thermal Profile. The first step is to ensure the thermal solution by design
CONTROL
for that power dissipation.
C
Thermal Management Logic and Thermal Monitor
and Thermal Profile Work
CONTROL
CONTROL
CONTROL
, then the thermal solution must meet the
CONTROL
®
Pentium
, then T
CONTROL
®
4 Processor on 90 nm
is
C
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