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Thermal Solutions
5.8
DTS Based Thermal Specification
5.8.1
Compliance to Tcase Based Thermal Profile
Processor heatsink design must still comply with the Tcase based thermal profile
provided in the Intel® Xeon® Processor E5-2400 Product Family Datasheet - Volume
One. Heatsink design compliance can be determined with thermocouple and TTV as
with previous processors.
The heat sink is sized to comply with the Tcase based thermal profile. Customers have
an option to either follow processor based Tcase spec or follow the DTS based thermal
specification. In some situations, implementation of DTS based thermal specification
can reduce average fan power and improve acoustics as compared to the Tcase based
thermal profile.
When all cores are active, a properly sized heatsink will be able to meet the DTS based
thermal specification. When all cores are not active or when Intel Turbo Boost
Technology is active, attempting to comply with the DTS based thermal specification
may drive system fans to maximum speed. In such situations, the T
will be below the T
5.8.2
Considerations for Follow-on Processor
The follow-on processor in the platform will have new capabilities as compared to the
Intel® Xeon® Processor E5-2400 Product Family. For example, the follow-on processor
has a new Package Configuration Space (PCS) command to read margin (M) from the
processor: RdPkgConfig(), Index 10. For the Intel® Xeon® Processor E5-2400 Product
Family, margin (M) must be calculated in firmware.
In the following sections, implementation details specified for the Intel® Xeon®
Processor E5-2400 Product Family can also be used for the follow-on processor.
For more information regarding the differences between the follow-on processor and
the Intel® Xeon® Processor E5-2400 Product Family see Platform Digital Thermal
Sensor (DTS) Based Thermal Specifications and Overview.
5.8.3
DTS Based Thermal Profile, Tcontrol and Margin for the
Intel® Xeon® Processor E5-2400 Product Family
The calculation of the DTS based thermal specification is based on both Tcontrol and
the DTS Based Thermal Profile (T
T
DTS
Where T
LA
appropriate External Design Specification (EDS). To implement the DTS based thermal
specification, these equations must be programmed in firmware. Since the equations
differ with processor SKU, SKUs can be identified by TDP, Core Count and a profile
identifier (CSR bits). For associated commands, see Platform Digital Thermal Sensor
(DTS) Based Thermal Specifications and Overview.
Power (P) is calculated in
specification also changes, so power and T
second.
Correction factor (F) compensates for the error in power monitoring. The current
estimate for F is 0.95.
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
based thermal profile by design.
CASE
= min[T
+ Ψ
* P * F, TEMPERATURE_TARGET [23:16] – Tcc_Offset]
LA
pa
+ Ψ
are the intercept and slope terms from the T
pa
Section
):
DTS
5.8.4. As power dynamically changes, the
calculations are recommended every 1
DTS
temperature
CASE
equations in the
DTS
41
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