Thermal Profile Adherence; Cek Heatsink Thermal Performance - Intel 5100 Series Instruction Manual

Thermal/Mechanical Reference Design
Figure 2-16. 1U CEK Heatsink Thermal Performance
0.50 0.50
0.45 0.45
0.40 0.40
0.35 0.35
0.30 0.30
0.25 0.25
0.20 0.20
0.15 0.15
0.10 0.10
2.4.6

Thermal Profile Adherence

The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for
the Dual-Core Intel
(mean+3sigma) performance of the thermal solution is computed to be 0.299°C/W and
the processor local ambient temperature (T
the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-8.y = 0.299x + 40
where,
y = Processor T
x = Processor power value (W)
Table 2-17
Profile to the Dual-Core Intel
1U CEK solution meets the Thermal Profile with 3.4°C margin at the lower end
(P
_PROFILE_MIN
Profile, it is ensured that no measurable performance loss due to TCC activation is
observed under the given environmental conditions.
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Mean Ψ Mean Ψ
σ = 0.0028 C/W σ = 0.0028 C/W
0 0 10 10
® ®
Xeon Processor 5148. From
value (°C)
CASE
below shows the comparison of this reference thermal solution's Thermal
®
Xeon
) and 6.0°C margin at the upper end (TDP). By designing to Thermal
Δ P = 2.73e-04CFM Δ P = 2.73e-04CFM
2 2
+ 1.86e-02CFM + 1.86e-02CFM
-0.8634 -0.8634
= 0.1831 + 1.1113*CFM = 0.1831 + 1.1113*CFM
ca ca
20 20 30 30
CFM Through Fins CFM Through Fins
Table 2-4
) for this thermal solution is 40°C. Hence,
LA
®
Processor 5148 Thermal Profile specification. The
0.80 0.80
0.70 0.70
0.60 0.60
0.50 0.50
0.40 0.40
0.30 0.30
0.20 0.20
0.10 0.10
0.00 0.00
40 40 50 50
the three-sigma
39