Table of Contents
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1.1
References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1.
Reference Documents
European Blue Angel Recycling Standards
Intel® Xeon® Processor 5500 Series Datasheet, Volume 1
Intel® Xeon® Processor 5500 Series Mechanical Model
Intel® Xeon® Processor 5500 Series Thermal Model
Entry-level Electronics Bay Specification
Notes:
1.
Document numbers indicated in Location column are subject to change. See the appropriate Electronic
Design Kit (EDK) for the most up-to-date Document number.
2.
Available at http://www.blauer-engel.de
3.
Available at http://ssiforum.oaktree.com/
1.2
Definition of Terms
Table 1-2.
Terms and Descriptions (Sheet 1 of 2)
Term
Bypass
DTS
FSC
IHS
ILM
LGA1366 socket
PECI
Ψ
CA
Ψ
CS
Ψ
SA
T
CASE
T
_
CASE
MAX
TCC
10
Document
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
Fan Speed Control
Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Independent Loading Mechanism provides the force needed to seat the 1366-LGA land
package onto the socket contacts.
The processor mates with the system board through this surface mount, 1366-contact
socket.
The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
Package Power. Heat source should always be specified for Ψ measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
Package Power.
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
The case temperature of the processor measured at the geometric center of the topside
of the IHS.
The maximum case temperature as specified in a component specification.
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
Location
321321
321326
321327
Description
CASE
CASE
– T
) / Total Package Power.
S
LA
Thermal/Mechanical Design Guide
Introduction
Notes
2
1
1
1
3
– T
) / Total
LA
– T
) / Total
S
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