References; Definition Of Terms; Reference Documents; Terms And Descriptions - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

1.1

References

Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1.

Reference Documents

2nd Generation Intel
Volume 1
2nd Generation Intel
Volume 2
2nd Generation Intel
Update
4-Wire Pulse Width Modulation (PWM) Controlled Fans
1.2

Definition of Terms

Table 1-2.

Terms and Descriptions

Term
Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this
example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest
surface.
CTE Coefficient of Thermal Expansion. The relative rate a material expands during a thermal event.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal
performance of the package. Component thermal solutions interface with the processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the 1155-LGA land package onto the
socket contacts.
PCH Platform Controller Hub. The PCH is connected to the processor via the Direct Media Interface (DMI) and
Intel® Flexible Display Interface (Intel® FDI).
LGA1155 socket The processor mates with the system board through this surface mount, 1155-land socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication
channel between Intel processor and chipset components to external monitoring devices.
 Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance
CA
using total package power. Defined as (T
be specified for  measurements.
 Case-to-sink thermal characterization parameter. A measure of thermal interface material performance
CS
using total package power. Defined as (T
 Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using
SA
total package power. Defined as (T
T or T The case temperature of the processor, measured at the geometric center of the topside of the TTV IHS.
CASE C
T _ The maximum case temperature as specified in a component specification.
CASE MAX
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock
modulation and/or operating frequency and input voltage adjustment when the die temperature is very
near its operating limits.
10
Document
® Core™ Processor Family Desktop Datasheet,
®
Core™ Processor Family Desktop Datasheet,
®
Core™ Processor Family Desktop Specification
– T
CASE
– T
CASE
– T ) / Total Package Power.
S LA
download.intel.com/
design/processor/
datashts/324641.pdf
download.intel.com/
design/processor/
datashts/324642.pdf
download.intel.com/
design/processor/
specupdt/324643.pdf
Available at http://
www.formfactors.org/
Description
) / Total Package Power. The heat source should always
LA
) / Total Package Power.
S
Thermal/Mechanical Specifications and Design Guidelines
Introduction
Location Notes
http://
http://
http://