Definition Of Terms; Thermal Design Process - Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008 Design Manual

Figure 1.

Thermal Design Process

Step 1: Thermal Simulation
• Package Level Thermal Models
• Thermal Model User's Guide
1.2

Definition of Terms

Table 1. Definition of Terms (Sheet 1 of 2)
Term
FCPGA
FCBGA
T
JUNCTION-MAX
Ψ
T
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG
7
Step 2: Heatsink Design
and Selection
• Reference Heatsinks
• Reference Mounting Hardware
• Vendor Contacts
Flip Chip Pin Grid Array. A pin grid array packaging technology where the die is
exposed on the package substrate.
Flip Chip Ball Grid Array. A ball grid array packaging technology where the die is
exposed on the package substrate.
Maximum allowed component (junction) temperature. Also referred to as T
Thermal Design Power. Thermal solutions should be designed to dissipate this
TDP
target power level.
Local ambient temperature. This is the temperature measured inside the chassis,
T
LA
approximately 1 inch upstream of a component heatsink. Also referred to as T
Junction-to-ambient thermal characterization parameter. A measure of heatsink
Ψ thermal performance using the total package power. Defined as (T
JA
Total Package Power
Thermal interface material thermal characterization parameter. A measure of
thermal interface material performance using total package power. Defined as (T
TIM
– T
CASE JUNCTION
Sink-to-ambient thermal characterization parameter. A measure of heatsink
Ψ thermal performance using total package power. Defined as (T
SA
Total Package Power.
°C Degrees in Celsius
CFM Volumetric airflow rate in cubic feet per minute
in. Inches
LFM Airflow velocity in linear feet per minute
PCB Printed circuit board
Heatsink temperature measured on the underside of the heatsink base.
SINK
Core™ 2 Duo Mobile Processors—Introduction
Definition
)/ Total Package Power. Also referred to as Ψ
Step 3: Thermal Validation
• Thermal Testing Software
• Thermal Test Vehicle
• User Guides
J-MAX
A
– T
JUNCTION LA
JS.
– T
SINK JUNCTION
June 2008
Order Number: 320028-001
.
) /
)/