Definition Of Terms; Terms And Descriptions - Intel Core i7-800 Specifications

1.2

Definition of Terms

Table 1-2.

Terms and Descriptions

Term
Bypass
CTE
DTS
FSC
IHS
ILM
PCH
LGA1156 socket
PECI
Ψ
CA
Ψ
CS
Ψ
SA
T or T
CASE C
T _
CASE MAX
TCC
T
CONTROL
TDP
Thermal Monitor
Thermal Profile
TIM
TTV
T
LA
T
SA
10
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
Coefficient of Thermal Expansion. The relative rate a material expands during a thermal
event.
Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
Fan Speed Control
Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Independent Loading Mechanism provides the force needed to seat the 1156-LGA land
package onto the socket contacts.
Platform Controller Hub. The PCH is connected to the processor via the Direct Media
®
Interface (DMI) and Intel Flexible Display Interface (Intel
The processor mates with the system board through this surface mount, 1156-land
socket.
The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
Package Power. The heat source should always be specified for Ψ measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
Power.
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
The case temperature of the processor, measured at the geometric center of the topside
of the TTV IHS.
The maximum case temperature as specified in a component specification.
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by
using clock modulation and/or operating frequency and input voltage adjustment when
the die temperature is very near its operating limits.
T is a static value that is below the TCC activation temperature and used as a
CONTROL
trigger point for fan speed control. When DTS > T
with the TTV thermal profile.
Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Line that defines case temperature specification of the TTV at a given power level.
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater
in the die to evaluate thermal solutions.
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
Description
®
FDI).
– T ) / Total Package Power.
S LA
, the processor must comply
CONTROL
§
Thermal/Mechanical Specifications and Design Guidelines
Introduction
– T ) / Total
CASE LA
– T ) / Total Package
CASE S