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5.1.12. REPLACEMENT PROCEDURE FOR LEADLESS (CHIP) COMPONENT
The following procedures are recommended for the replacement of the leadless components
used in this Unit.
1. Preparation for replacement
A. Soldering Iron
Use a pencil-type soldering iron using less than 30 watts.
B. Solder
Eutectic Solder (Tin 63%, Lead 37%) is recommended.
C. Soldering time
Do not apply heat for more than 4 seconds.
D. Preheating
Leadless capacitor must be preheated before installation.
(130°C ~ 150°C, for about 2 minutes.)
Note:
A. Leadless component must not be reused after removal.
B. Excessive mechanical stress and rubbing of the component
electrode must be avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers and alternately
apply heat to both electrodes. When the solder on both electrodes
is melted, remove leadless component with a twisting motion.
Note:
A. Do not attempt to lift the component off the board until the
component is completely disconnected from the board by a
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