Mitsubishi MELSEC-WS0-CPU0 User Manual page 106

Chapter 12
103
Technical data
Test outputs (X1, X2)
Number of outputs
Output type
Output voltage High
Output resistance Low
Output current
Test pulse rate (test period)
Test pulse duration (test gap)
Load capacity
Cable resistance
Safe outputs (Q1 ... Q4)
Number of outputs
Output type
Output voltage High
Leakage current Low
Normal operation
Fault case *4
Hardware version < V1.10.1
Hardware version ≥ V1.10.1
Output current
Total current I
sum
T ≤ 45 °C
A
T ≤ 55 °C
A
For UL/CSA applications
*5
Test pulse width
Test pulse rate
Capacitive load
*8
Cable resistance
Max. permitted coil energy without
external protection elements
Hardware version V1.00.0
Hardware version ≥ V1.01.0
Response time
Data interface
2 (with 2 test pulse generators)
PNP semiconductor, short-circuit protected, short-
circuit monitoring (selectable)
15 ... 30 V DC (max. 1.8 V drop to terminal A1 of
CPU module)
≤33 Ω ± 10 %, current limited at approx. 10 mA
Max. 120 mA at each test output (X1 or X2)
This means that a maximum of 8 testable sensor
cascades per module with max. 30 mA each are
possible.
The total current for the MELSEC-WS safety
controller for all outputs (X1...X8 and XY1...XY2) is
limited to a maximum of 1.28 A. This corresponds to
e.g. a maximum of 32 testable sensor cascades with
30 mA each plus 64 tactile sensors on inputs on
safety I/O modules with 5 mA each.
1 ... 25 Hz, configurable
1 ... 100 ms, configurable
1 μF for test gap ≥ 4 ms
0.5 μF for test gap 1 ms
< 100 Ω
4
PNP semiconductor, short-circuit protected, short-
circuit monitoring (selectable)
16 ... 30 V DC (max. 0.8 V drop to terminal A1 of
this module)
Max. 0.1mA
Max. 1.6 mA
Max. 2.0 mA
Max. 2.0 A
Max. 4.0 A
Max. 3.2 A
Max. 3.2 A
< 650 μs or disabled
Max. 5 Hz
≤ 0.5 μF
Max. 5 Ω (e.g. 100 m × 1.5 mm² = 1.2 Ω)
*9
0.22 J
0.37 J
Depending on the logic configuration, for details see
Table 53.
Backplane bus(FLEXBUS+)
*6*7