Table Of Contents - Intel EM64T - Celeron D 336 Boxed Ena User Manual

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Contents
1 Introduction ......................................................................................................................... 9
1.1 Document Goals and Scope .................................................................................. 9
1.1.1
1.1.2
1.1.3
1.2 References ........................................................................................................... 11
1.3 Definition of Terms ............................................................................................... 12
2 Processor Thermal/Mechanical Information ..................................................................... 15
2.1 Mechanical Requirements.................................................................................... 15
2.1.1
2.1.2
2.2 Thermal Requirements......................................................................................... 18
2.2.1
2.2.2
2.2.3
2.3 Heatsink Design Considerations .......................................................................... 21
2.3.1
2.3.2
2.3.3
2.3.4
2.4 System Thermal Solution Considerations ............................................................ 23
2.4.1
2.4.2
2.4.3
2.5 System Integration Considerations ...................................................................... 24
3 Thermal Metrology ............................................................................................................ 25
3.1 Characterizing Cooling Performance Requirements............................................ 25
3.1.1
3.2 Processor Thermal Solution Performance Assessment ...................................... 27
3.3 Local Ambient Temperature Measurement Guidelines........................................ 27
3.4 Processor Case Temperature Measurement Guidelines..................................... 30
4 Thermal Management Logic and Thermal Monitor Feature ............................................. 31
4.1 Processor Power Dissipation ............................................................................... 31
4.2 Thermal Monitor Implementation.......................................................................... 31
4.2.1
4.2.2
4.2.3
Thermal/Mechanical Design Guide
Importance of Thermal Management ..................................................... 9
Document Goals ..................................................................................... 9
Document Scope .................................................................................. 10
Processor Package............................................................................... 15
Heatsink Attach..................................................................................... 17
2.1.2.1 General Guidelines.............................................................. 17
2.1.2.2 Heatsink Clip Load Requirement ........................................ 17
2.1.2.3 Additional Guidelines........................................................... 18
Processor Case Temperature .............................................................. 18
Thermal Profile...................................................................................... 19
T ................................................................................................ 20
CONTROL
Heatsink Size ........................................................................................ 22
Heatsink Mass ...................................................................................... 22
Package IHS Flatness .......................................................................... 22
Thermal Interface Material.................................................................... 23
Chassis Thermal Design Capabilities................................................... 23
Improving Chassis Thermal Performance ............................................ 23
Summary............................................................................................... 24
Example ................................................................................................ 26
PROCHOT# Signal ............................................................................... 32
Thermal Control Circuit......................................................................... 32
Operation and Configuration................................................................. 33
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