Intel EM64T - Celeron D 336 Boxed Ena User Manual page 5

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A.2.2
A.2.3
A.2.4
A.2.5
A.3 Heatsink Selection Guidelines ............................................................................. 66
Appendix B Heatsink Clip Load Metrology ........................................................................................... 67
B.1 Overview............................................................................................................... 67
B.2 Test Preparation ................................................................................................... 67
B.2.1
B.2.2
B.3 Test Procedure Examples .................................................................................... 70
B.3.1
B.3.2
Appendix C Thermal Interface Management........................................................................................ 73
C.1 Bond Line Management ....................................................................................... 73
C.2 Interface Material Area ......................................................................................... 73
C.3 Interface Material Performance ............................................................................ 73
Appendix D Case Temperature Reference Metrology ......................................................................... 75
D.1 Objective and Scope ............................................................................................ 75
D.2 Definitions............................................................................................................. 75
D.3 Supporting Test Equipment.................................................................................. 76
D.4 Thermal Calibration and Controls ........................................................................ 77
D.5 IHS Groove........................................................................................................... 77
D.6 Thermocouple Attach Procedure ......................................................................... 80
D.6.1
D.6.2
D.6.3
D.7 Thermocouple Wire Management........................................................................ 86
Appendix E Board Level PWM and Fan Speed Control Requirements ............................................... 87
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations ........................ 91
Appendix G Mechanical Drawings........................................................................................................ 93
Appendix H Intel Enabled Reference Solution Information ................................................................ 105
Thermal/Mechanical Design Guide
Motherboard Deflection Metric Definition ............................................. 62
Board Deflection Limits......................................................................... 63
Board Deflection Metric Implementation Example................................ 64
Additional Considerations ..................................................................... 65
A.2.5.1 Motherboard Stiffening Considerations............................... 65
Heatsink Preparation ............................................................................ 67
Typical Test Equipment ........................................................................ 70
Time-Zero, Room Temperature Preload Measurement ....................... 71
Preload Degradation under Bake Conditions ....................................... 71
Thermocouple Conditioning and Preparation ....................................... 80
Thermocouple Attachment to the IHS .................................................. 80
Curing Process ..................................................................................... 84
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