Definition Of Terms - Intel EM64T - Celeron D 336 Boxed Ena User Manual

Introduction
1.3

Definition of Terms

Term
T
T
T
T
T
C-MAX
Ψ
Ψ
Ψ
TIM
P
MAX
TDP
IHS
LGA775 Socket
ACPI
Bypass
Thermal Monitor
TCC
T
DIODE
12
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan
A
inlet for an active heatsink.
The case temperature of the processor, measured at the geometric center of the
C topside of the IHS.
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
E
Heatsink temperature measured on the underside of the heatsink base, at a location
T
corresponding to
S
The maximum case temperature as specified in a component specification.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
Power.
CA
Note: Heat source must be specified for
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
Power.
CS
Note: Heat source must be specified for
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
SA
Note: Heat source must be specified for
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
The maximum power dissipated by a semiconductor component.
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
Integrated Heat Spreader: A thermally conductive lid integrated into a processor
package to improve heat transfer to a thermal solution through heat spreading.
The surface mount socket designed to accept the Pentium 4 processor in the 775–
land LGA package.
Advanced Configuration and Power Interface.
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
A feature on the Pentium 4 processor in the 775–land LGA package that attempts to
keep the processor die temperature within factory specifications.
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
lowering effective processor frequency when the die temperature has exceeded its
operating limits.
Temperature reported from the on-die thermal diode.
Description
.
C
Ψ
measurements.
Ψ
measurements.
Ψ
measurements.
Thermal/Mechanical Design Guide
– T ) / Total Package
C A
– T ) / Total Package
C S
– T ) / Total Package Power.
S A
R