Intel BX80571E7400 - Core 2 Duo 2.8 GHz Processor Manuallines page 4

4.2.5
4.2.6
4.2.7
4.2.8
4.2.9
4.2.10
4.2.11
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ........41
5.1 Overview of the BTX Reference Design ....................................................41
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
5.2 Environmental Reliability Testing ............................................................45
5.2.1
5.2.2
5.2.3
5.3 Material and Recycling Requirements ......................................................48
5.4 Safety Requirements ............................................................................49
5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly ........49
5.6 Preload and TMA Stiffness .....................................................................50
5.6.1
5.6.2
6 ATX Thermal/Mechanical Design Information.......................................................53
6.1 ATX Reference Design Requirements .......................................................53
6.2 Validation Results for Reference Design ...................................................55
6.2.1
6.2.2
6.2.3
6.2.4
6.3 Environmental Reliability Testing ............................................................57
6.3.1
6.3.2
6.3.3
6.4 Material and Recycling Requirements ......................................................60
6.5 Safety Requirements ............................................................................61
6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......61
6.7 Reference Attach Mechanism..................................................................62
6.7.1
6.7.2
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7 Intel Quiet System Technology (Intel
7.1 Intel
7.1.1
7.1.2
4
On-Demand Mode ...................................................................37
System Considerations.............................................................37
Operating System and Application Software Considerations ...........38
THERMTRIP# Signal.................................................................38
Cooling System Failure Warning ................................................38
Digital Thermal Sensor.............................................................38
Platform Environmental Control Interface (PECI).......................... 39
Target Heatsink Performance ....................................................41
Acoustics ...............................................................................42
Effective Fan Curve .................................................................43
Voltage Regulator Thermal Management .....................................44
Altitude..................................................................................45
Reference Heatsink Thermal Validation .......................................45
Structural Reliability Testing .....................................................45
5.2.1.1 Random Vibration Test Procedure................................45
5.2.1.2 Shock Test Procedure ................................................46
Power Cycling .........................................................................47
Recommended BIOS/CPU/Memory Test Procedures ......................48
Structural Design Strategy........................................................50
TMA Preload verse Stiffness ......................................................50
Heatsink Performance ..............................................................55
Acoustics ...............................................................................56
Altitude..................................................................................56
Heatsink Thermal Validation .....................................................57
Structural Reliability Testing .....................................................57
6.3.1.1 Random Vibration Test Procedure................................57
6.3.1.2 Shock Test Procedure ................................................58
Power Cycling .........................................................................59
Recommended BIOS/CPU/Memory Test Procedures ......................60
Structural Design Strategy........................................................62
Mechanical Interface to the Reference Attach Mechanism ..............63
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QST Algorithm ............................................................................65
Output Weighting Matrix ..........................................................66
Proportional-Integral-Derivative (PID) ........................................66
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QST) .....................................................65
Thermal and Mechanical Design Guidelines