Mechanical Form Fact Or; Therm Al Managem Ent; Syst Em Feat Ures And Operat Ion; I Nt El( R) 945Gme Gmch - Intel Core 2 Duo User Manual

Th e or y of Ope r a t ion—I nt e l
3 .2 M e ch a n ica l For m Fa ct or
The evaluat ion board conform s t o t he ATX form fact or. For ext ra prot ect ion in a
developm ent environm ent , you m ay want t o inst all t he evaluat ion board in an ATX
chassis. I nt ernal and rear panel syst em I / O connect ors are described in
An overview of connect or and slot locat ions is provided in
3 .3 The r m a l M a na ge m e nt
The obj ect ive of t herm al m anagem ent is t o ensure t hat t he t em perat ure of each
com ponent is m aint ained wit hin specified funct ional lim it s. The funct ional t em perat ure
lim it is t he range wit hin which t he elect rical circuit s can be expect ed t o m eet t heir
specified perform ance requirem ent s. Operat ion out side t he funct ional lim it can degrade
syst em perform ance and cause reliabilit y problem s.
The developm ent kit is shipped wit h a fansink t herm al solut ion for inst allat ion on t he
processor. This t herm al solut ion has been t est ed in an open- air environm ent at room
t em perat ure and is sufficient for evaluat ion purposes. The designer m ust ensure t hat
adequat e t herm al m anagem ent is provided for any cust om er- derived designs.
3 .4 Syst e m Fe a t u r e s a n d Ope r a t ion
The following sect ions provide a det ailed view of syst em feat ures and operat ion. Refer
t o Figure 2
The I nt el
Hub and t he I nt el
3 .4 .1 I n t e l( R) 9 4 5 GM E GM CH
The I nt el
®
for I nt el
graphics. I t provides flexibilit y and scalabilit y in graphics and m em ory subsyst em
perform ance. The following list describes t he reference board's im plem ent at ion of t he
®
I nt el 945GME Express Chipset GMCH feat ures.
A list of feat ures follows:
• 1466 Micro- FCBGA package
• 533/ 667 MHz Front Side Bus
• 36- bit host bus addressing
• Syst em m em ory cont roller ( DDR2 im plem ent ed)
— Support s Dual Channel and Single Channel operat ion
— Two 200- pin SODI MM slot s
— DDR2 400/ 533/ 667
• Direct Media I nt erface ( DMI )
• I nt egrat ed graphics based on I nt el's Graphics Media Accelerat or 950
— Direct ly support s on- board VGA, S-Video and LVDS int erfaces.
— Support s resolut ions up t o 2048 x 1536 @ 75 Hz.
• SDVO int erface via PCI Express* x16 connect or provides m axim um display
flexibilit y
— Can drive up t o t wo display out put s
May 2007
Order Num ber: 317443- 001US
®
9 4 5 GM E Ex pr e ss Chipse t
and Table 7 for t he locat ion of t he m aj or com ponent s of t he plat form .
®
945GME Express Chipset feat ures t he 82945GM Graphics Mem ory Cont roller
®
I / O Cont roller Hub ( I CH7- M) .
®
945GME Express Chipset GMCH provides t he processor int erface opt im ized
TM
Core 2 Duo processors, syst em m em ory int erface, DMI and int ernal
®
I nt el Core
TM
2 Duo processor wit h t he Mobile I nt el
Sect ion 3.4.3.
Sect ion 4.0.
®
945GME Express Chipset
Manual
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