2 .0
Ge t t in g St a r t e d
This chapt er ident ifies t he evaluat ion kit 's key com ponent s, feat ures and specificat ions.
I t also det ails basic board set up and operat ion.
2 .1
Ove r vie w
The evaluat ion board consist s of a baseboard populat ed wit h t he I nt el
processor and t he I nt el
and peripheral connect ors.
Not e:
The evaluat ion board is shipped as an open syst em allowing for m axim um flexibilit y in
changing hardware configurat ion and peripherals. Since t he board is not in a prot ect ive
chassis, t ake ext ra precaut ion when handling and operat ing t he syst em .
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2 .1 .1
I n t e l
Fe a t u r e s
Feat ures of t he developm ent kit board are sum m arized below:
Pr oce ssor
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• I nt el
478 pin Flip Chip Pin Grid Array ( Micro- FCPGA) package
M obile I n t e l
Ex pr e ss GM CH )
• 1466 pin Micro- FCBGA Package
• Support s a 533/ 667 MHz front side bus
• Support s dual- Channel DDR2 at 400/ 533/ 667 MHz
• Two SODI MM slot s ( one per channel) support DDR2 SODI MMS ( unbuffered, non-
ECC) m odules
• Support s 128 MByt es t o 4 GByt es using 256 Mbit , 512 Mbit , or 1 Gbit t echnology
• x16 PCI Express* Graphics or Serial Digit al Video Out ( SDVO) port
• 18 bpp LVDS, VGA & TV- D connect or support
I / O Cont r olle r H ub 7 ( I CH 7 - M )
• 652 pin plast ic BGA package
• DMI ( x4) int erface wit h GMCH
• Two SATA and one I DE ( 40 pin) Hard Drive int erface
• Two PCI 2.3 com pliant deskt op slot s
• 82802AC8 Firm ware Hub ( FWH)
• 82573E Gigabit Et hernet Cont roller
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TM
I nt el
Core
2 Duo processor wit h t he Mobile I nt el
Manual
16
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945GME Express Chipset , ot her syst em board com ponent s,
9 4 5 GM E Ex pr e ss Ch ipse t D e ve lopm e n t Kit
TM
Core
2 Duo processor wit h 4 MByt e L2 Cache on 65nm process in t he
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9 4 5 GM E Ex pr e ss Gr a phics M e m or y Cont r olle r H ub ( 9 4 5 GM E
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945GME Express Chipset
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I n t e l
9 4 5 GM E Ex pr e ss Ch ipse t —Ge t t in g St a r t e d
Order Num ber: 317443- 001US
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TM
Core
2 Duo
May 2007
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