Chapter 7 Troubleshooting; Modular Design - Toptech MultiLoad II Mobile Installation Manual

Chapter 7 – Troubleshooting
CHAPTER 7
7.1 M
ODULAR
The MultiLoad II DIV-2 has been constructed with replaceable modules or sub-assemblies that are available from
Toptech (see Appendix for part numbers). These include:

CPU Subassembly (CPU Chassis, CPU Board, Power Supply / COM Board, I/O Board).

Display Subassembly (Active Matrix Display and Display Board)

Keypad

Prox Reader
The following sections describe how to remove and replace each subassembly and where possible, how to further
disassemble the subassembly
!
NOTE: Do not service MultiLoad II without removing power.
!
NOTE: Do not open the MultiLoad II enclosure while the MultiLoad II is energized.
MultiLoad II Mobile Installation Guide: Version C
T
ROUBLESHOOTING
D :
ESIGN
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