Chapter 1 – General
1.4
E
LECTROSTATIC
The MultiLoad II contains electronic components and assemblies subject to damage by ESD. The MultiLoad II
was designed to protect against ESD while the unit is closed and in normal operation.
procedures must be observed during the removal, installation, repair and other handling of printed circuit board
assemblies, electronic devices and components to include:
1)
Service to be performed by authorized personnel only.
2)
The person performing the service must be grounded by an ESD grounding strap and connected to
ground.
3)
While performing maintenance or repair, touch an unpainted metal of the MultiLoad II surface prior to
touching or handling any printed circuit boards or electronic components.
4)
Printed circuit board assemblies must be placed in and transported in conductive bags or other
conductive containers.
5)
Printed circuit boards must not be removed from the conductive container until time of use.
6)
All other "best" practices for protecting devices from ESD must be observed.
MultiLoad II Mobile Installation Guide: Version C
D
(ESD) P
ISCHARGE
ROTECTION
:
7
Proper handling
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