Appendix C: System Specifications
Appendix C
System Specifications
Processors
Single 3rd Gen Intel Xeon Scalable processors in a P+ (LGA4189) socket with up to 28 cores and a thermal design power
(TDP) of up to 185W
Chipset
Intel PCH C621A
BIOS
AMI BIOS; ACPI 3.0 or later, PCI firmware 4.0 support, BIOS rescue hot-key, SPI dual/quad speed support, RTC (Real Time
Clock) wakeup, and SMBIOS 3.0 or later
Memory
(Per node) Eight DIMM slots, DDR4 RDIMM/LRDIMM or Intel Optane PMem 200 Series*
(up to 2TB for DDR4, or up to 2TB of PMem and 1TB DDR4)
Up to 3200MHz; size up to 256GB
* Note: PMem 200 Series are supported on 3rd Gen Intel Xeon Scalable Platinum, Gold and selected Silver processors.
Storage Drives
(Per node) Six 2.5" SATA drive bays
Two M.2 NVMe SSDs
PCI Expansion Slots
(Per node) Two PCIe 4.0 x16, low profile
Input/Output
(Per node) Two 10G SFP+ ports
One dedicated IPMI port
One VGA port
One COM header port (internal header)
Two USB3.2 Gen1 ports
Motherboard
(Per node) X12SPT-PT; proprietary 6.8" (W) x 18.86" (L) (173 mm x 479 mm)
Chassis
CSE-217HQ+-R2K04BP4; 2U Rackmount, (WxHxD) 17.3" x 3.5" x 28.75" (438 x 88 x 730mm)
System Cooling
Four 8-cm heavy-duty PWS fans; (per node) two CPU heatsinks, one air shroud to direct air flow
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