Related Manuals for RadiSys PROCELERANT CE915GMA
Summary of Contents for RadiSys PROCELERANT CE915GMA
- Page 1 PROCELERANT ® CE915GM COM EXPRESS MODULE PRODUCT MANUAL CE915GMA CE915GME www.radisys.com 007-02532-0004 • August 2010 Arrow.com. Downloaded from...
- Page 2 Portions of this manual are copyrighted by the PCI Industrial Computer Manufacturers Group, and are reprinted with permission. RadiSys and Procelerant are registered trademarks of RadiSys Corporation. PICMG is a registered trademark and COM Express is a trademark of the PCI Industrial Computer Manufacturers Group. Intel, Pentium and Celeron are registered trademarks.
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Page 3: Table Of Contents
TABLE OF CONTENTS Preface..............................7 About this manual............................7 What’s new in this manual ...........................8 Safety notices ..............................8 Electrostatic discharge............................8 Where to get more product information .......................8 Chapter 1: Product Overview ......................9 Product codes............................10 COM Express modules............................10 System memory..............................10 Thermal options .............................. - Page 4 Voltage requirements............................25 Inrush current..............................25 CPU ................................27 Voltage requirements............................27 Thermal requirements............................27 Clock generator ..............................28 System memory............................28 Chipset ..............................28 Graphics Memory Controller Hub (GMCH) ......................28 I/O Controller Hub (ICH) ............................ 29 Video .................................29 PCI Express graphics ............................29 VGA ...................................
- Page 5 Passive heatsinks............................39 Product package components ........................... 39 Mechanical specification............................ 40 Heat spreader............................42 Thermal interface materials ........................42 Chapter 5: BIOS Configuration......................43 POST and boot process ..........................43 BIOS setup ..............................43 Update and recovery ..........................44 BIOS customization ...........................44 Appendix A: COM Express Module Pinout Definitions ..............45 Type 2 pinout definitions..........................45 Appendix B: System Resources .....................
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Page 7: Preface
When referenced in this manual, the simplified name of Quick Start Guide will be used. • BIOS configuration information. The Procelerant CE915GMA BIOS Setup Utility Specification describes the BIOS setup utility interfaces and configuration options. When referenced in this manual, the simplified name of BIOS Setup Utility Specification will be used. -
Page 8: What's New In This Manual
Hold modules only by their edges and mounting hardware. Avoid touching PCB components and connector pins. For further information on ESD, visit www.esda.org. Where to get more product information Visit the RadiSys web site at www.radisys.com for product information and other resources. Downloads (manuals, release notes, software, etc.) are available at www.radisys.com/downloads. -
Page 9: Chapter 1: Product Overview
PRODUCT OVERVIEW The Procelerant CE915GM COM Express embedded computing module is a standard form factor (“basic module” with type 2 pinouts) Computer on Module (COM) mezzanine board, compliant with PICMG COM Express Module Base Specification Version 1.0. ® COM Express modules enable high reuse and interchangeability of COM Express modules and carrier boards, and hence reduce time-to-market by removing the embedded computing module from the list of major components to design, which in turn lowers costs. -
Page 10: Product Codes
• GMCH chipset represents both Intel 915GM and 915GME chipsets. • ICH chipset represents the Intel ICH6-M chipset. Product codes Check the CE915GM product page on the RadiSys Web site or contact your sales representative for the latest information about product offerings. COM Express modules All CE915GM modules are RoHS compliant. -
Page 11: Module Layout
Module layout Module layout Figure 2. Module layout: top view Header for clearing CMOS and recovering BIOS DDR2 SO-DIMM memory socket Mobile Intel 915GM Express chipset POST LED (D5) Intel 82573V Phoenix FirstBIOS Intel ICH6M Reset LED (D4) Ethernet controller Notebook (Pro) BIOS ROM Arrow.com. - Page 12 Product Overview Figure 3. Module layout: bottom view Board-to-board interconnectors Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from...
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Page 13: Chapter 2: Product Specifications
PRODUCT SPECIFICATIONS Mechanical The size of the CE915GM modules’ printed circuit board (PCB) is 95mm x 125mm, which complies with the Basic Module Size outlined in the PICMG COM Express Specification Revision 1.0. The thickness of the PCB is 0.079 inch [2mm]. Figure 4—Figure 7 show the form factor and envelope dimensions of CE915GM modules in millimeters [inches]. - Page 14 Product Specifications Figure 5. CE915GM envelope dimensions: top view Max SO-DIMM height = 30 [1.181] DDR2 200-pin 1.8V 6x 2.69 [.106] 95 [3.740] 91 [3.58] 91 [3.58] 78.35 [3.085] 65 [2.559] 59.52 [2.343] 57.85 [2.277] 4x 2.21 [.087] 43.43 [1.710] 37.35 [1.470] 40.26 [1.585] 4 [.157]...
- Page 15 Mechanical Figure 6. CE915GM envelope dimensions: bottom view 0 [.000] 6 [.236] 18 [.709] Backer plate option supplied w/M2 screws 0.89 [.035] 1.6[.063] Locating posts for 440-pin receptacle Figure 7. CE915GM component dimensions: top view Pentium M or Celeron M processor BGA height = 2.85 [.112] Max DDR2 SO-DIMM socket height 2.60 [.102] Min...
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Page 16: Component Height Between Module And Carrier Board
Product Specifications Component height between module and carrier board Parts mounted on the bottom surface of CE915GM modules (between the module and the carrier board) have a maximum height of 3.8mm. This affects the maximum allowable height of carrier board components underneath the module. •... -
Page 17: Electrical
Electrical Electrical Module power consumption The amount of power consumed by CE915GM modules is highly dependent on the processor, memory, attached devices, software in use, and power state that the module is in. Sample measurements were taken using the CR100 carrier board as follows: •... - Page 18 Product Specifications CE760A power dissipation System +3.3V +12V +5VSB consumption Main Rail Current Consumption Current (A) Current (A) Current (A) Current (A) Watts — — — — — Specification — — — Enter DOS (Stable) 0.43 0.37 1.04 0.063 16.08 Enter BIOS Setup (Stable) 0.43 0.32...
- Page 19 Module power consumption CE373A power dissipation System +3.3V +12V +5VSB consumption Main Rail Current Consumption Current (A) Current (A) Current (A) Current (A) Watts — — — — — Specification — — — Enter DOS (Stable) 0.25 0.69 0.95 0.040 15.92 Enter BIOS Setup (Stable) 0.25...
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Page 20: General Purpose I/O (Gpio) Power Consumption
Product Specifications CE738B power dissipation System +3.3V +12V +5VSB consumption Main Rail Current Consumption Current (A) Current (A) Current (A) Current (A) Watts — — — — — Specification — — — Enter DOS (Stable) 0.43 0.39 1.15 0.034 17.34 Enter BIOS Setup (Stable) 0.43 0.39... -
Page 21: Thermal Design Power
Thermal design power Thermal design power The table below shows the thermal design power (TDP) required by CE915GM modules. Product code Hardware configuration CE760A-0 2.2GHz Pentium M 760 BGA processor without memory CE738A-0 1.4GHz LV Pentium M 738 BGA processor without memory CE373A-0 1.0GHz ULV Celeron M 373 BGA processor without memory CE370A-0... -
Page 22: Emc Compliance
Product Specifications EMC compliance When correctly installed in a suitable chassis, CE915GM modules are designed to meet these EMC regulations: • EN55022, EN55024 • FCC Part 15, Subpart B, Class B Safety compliance When correctly installed in a suitable chassis, CE915GM modules are designed to meet these safety regulations: •... -
Page 23: Chapter 3: Hardware Reference
HARDWARE REFERENCE General specifications Feature Function Description Physical Dimensions 95mm x 125mm - COM Express basic form factor Compliance PICMG COM Express R1.0 basic form factor, type 2 Processor BGA options • 1.5GHz Celeron M 370 • 1.0GHz ULV Celeron M 373 •... -
Page 24: Block Diagram
Hardware Reference Feature Function Description OS support • Windows XP • Windows XP Embedded • Red-Hat Desktop Linux • Windows 2000 • MontaVista Linux Professional Edition ® • VxWorks 5.5 • OS/9 • QNX Neutrino Warranty Two years Block diagram Figure 8. -
Page 25: Power Supply
Power supply Power supply Voltage requirements The power of CE915GM modules comes from the carrier board, and there is a common 3V battery supply for the real-time clock (RTC). Power supply requirements are as follows. Supply Current/Watts Maximum Ripple 4.1A/49W DC 5% ripple 100mV @ 0~20MHz 5V Standby 1A/5W... - Page 26 Hardware Reference Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from...
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Page 27: Cpu
CE915GM modules are available with Intel Pentium M and Celeron M BGA processors to support different requirements, such as performance, heat dissipation, space limitations, or voltage needs. For detailed information on these processors, visit the Intel Web site, www.intel.com. Voltage requirements The processors on CE915GM modules require separate power rails to isolate power for the internal processor, core PLLs (1.5V), and processor I/O (1.05V). -
Page 28: Clock Generator
CE915GM modules provide one 200-pin SO-DIMM socket to accept DDR2-400/533 64-bit, non-ECC, non-parity memory modules. 128MB to 1GB memory is supported. The socket can accept either single or double-sided modules. Visit www.radisys.com for a list of memory tested with this product. In general, compatible memory modules must: •... -
Page 29: I/O Controller Hub (Ich)
I/O Controller Hub (ICH) I/O Controller Hub (ICH) The following are functions and capabilities ICH6-M provides extensive I/O support. For further information on the ICH6-M, visit the Intel Web site. • Compliant with PCI Express Base Specification Version 1.0a • Compliant with PCI Local Bus Specification Version 2.3 to support 33 MHz PCI operations •... -
Page 30: Vga
Hardware Reference CE915GM modules use the integrated Intel Graphics Media Accelerator 950 controller to support the following VGA features: • Analog CRT DAC interface • DAC frequencies up to 400MHz • 24-bit RAMDAC • Analog monitor support up to QXGA (2048x1536) •... -
Page 31: Audio
Audio Functionality depends on the carrier board interfaces. For example: • On the CR100-2DVI carrier board, the GMCH multiplexes the PCI Express x16 graphics slot with two Intel SDVO ports. This allows the x16 PCI Express graphics slot to be used as a x1 PCI Express slot. -
Page 32: Ide
Hardware Reference The fast IDE interface supports up to two IDE devices providing an interface for IDE hard disks and ATAPI devices. Each IDE device can have independent timings. The IDE interface supports PIO IDE transfers up to 16 MBps and Ultra ATA transfers up 100 MBps. It does not consume any legacy DMA resources. -
Page 33: 10/100/1000Base-T Ethernet Controller
10/100/1000BASE-T Ethernet controller 10/100/1000BASE-T Ethernet controller CE915GM modules use the Intel 82573V Gigabit Ethernet controller for high performance network application. The device is fabricated in a 1.2V CMOS process providing a low- power system solution. The Ethernet controller supports: • PCI Express x1 interface •... -
Page 34: Acpi Wake Up
Hardware Reference Table 5. Supported ACPI states for 12V product options VCC state Supported ACPI states Description 5V_SBY G0/S0 G1/S3 G1/S4 G2/S5 Power off – – – – ü Carrier board with no standby support ü – * Standby –... -
Page 35: Miscellaneous Indicators
Miscellaneous indicators Miscellaneous indicators The new reset LED and POST LED are available on the top side of CE915GM modules. For locations of these LEDs, see Figure 2 on page Reset LED The reset LED indicates the system reset status. This LED is illuminated during system reset. - Page 36 Hardware Reference Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Downloaded from Downloaded from Downloaded from Downloaded from...
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Page 37: Chapter 4: Thermal Solutions
Carrier Board Design Guidelines from RadiSys for further information. As long as thermal requirements are met, RadiSys heatsinks (CE-AHS, CE-PHS, CE-PHS17) or custom thermal solutions designed for the previously released models (CE760, CE738, CE373, and CE370) can be used on the CE915GMA and CE915GMB series modules. - Page 38 Thermal Solutions Figure 11. CE-AHSA dimensions 8.90 12.00 10.31 3.94 10.31 6.00 36.81 55.38 71.5 0.2 1.85 Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com.
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Page 39: Passive Heatsinks
Passive heatsinks Passive heatsinks The CE-PHSA and CE-PHS17A passive heatsinks differ only in the height of the aluminium heatsink. See dimensions in the sections below. • CE-PHS: for CE915GM modules in a minimum 1U chassis. An airflow of 300lfm [1.5m/ sec] is required by the chassis fan. -
Page 40: Mechanical Specification
Thermal Solutions Mechanical specification Figure 12. CE-PHSA dimensions 3.94 15.90 41 0.1 116.97 0.1 125 0.2 116.5 26.5 35-1.3- 2-M2.5 4.5 0.1 SECTION A-A MOVING Figure 13. CE-PHS17A dimensions Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. - Page 41 Mechanical specification 2-4.1 0.2 13-1.2 0.15 4 0.1 45 0.1 121 0.1 125 0.1 39-1.3 0.15 2-2.95 0.2 5- 2.8 5- 4.5 0.1 Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com.
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Page 42: Heat Spreader
If your application requires the fastest CPU speed, a high ambient temperature, and a workload at or exceeding the TDP, phase change material is required. RadiSys offers a phase-change thermal interface material (RadiSys product code CE-TIM), which phase changes at 58°C. Table 6 shows the recommended providers of thermal interface materials. -
Page 43: Chapter 5: Bios Configuration
BIOS CONFIGURATION The system BIOS is based on the Phoenix FirstBIOS™ Notebook (Pro) BIOS with RadiSys ® extensions. BIOS features include: • ACPI 2.0 wake up from S3, S4, and S5 • High-resolution, GUI-based, customizable splash screen • COM port console redirection •... -
Page 44: Update And Recovery
BIOS Configuration Update and recovery BIOS release packages, update and recovery tools are periodically available on the RadiSys Web site to address known issues or to add new features. The release packages include detailed instructions for updating and recoverying the BIOS. -
Page 45: Appendix A: Com Express Module Pinout Definitions
COM EXPRESS MODULE PINOUT DEFINITIONS Type 2 pinout definitions Table 7. Board-to-board interconnector pinout definitions — Type 2 Row A Row B Row C Row D GND (FIXED) GND (FIXED) GND (FIXED) GND (FIXED) GBE0_MDI3- GBE0_ACT# IDE_D7 IDE_D5 GBE0_MDI3+ LPC_FRAME# IDE_D6 IDE_D10 GBE0_LINK100#... - Page 46 COM Express Module Pinout Definitions Table 7. Board-to-board interconnector pinout definitions — Type 2 (continued) Row A Row B Row C Row D BIOS_DISABLE# I2C_DAT PCI_PERR# PCI_STOP# THRMTRIP# THRM# PCI_LOCK# PCI_TRDY# USB6- USB7- PCI_DEVSEL# PCI_FRAME# USB6+ USB7+ PCI_IRDY# PCI_AD16 USB_6_7_OC# USB_4_5_OC# PCI_C/BE2# PCI_AD18...
- Page 47 Type 2 pinout definitions Table 7. Board-to-board interconnector pinout definitions — Type 2 (continued) Row A Row B Row C Row D LVDS_A2- LVDS_B2- LVDS_VDD_EN LVDS_B3+ RSVD IDE_CBLID# LVDS_A3+ LVDS_B3- PEG_RX8+ PEG_TX8+ LVDS_A3- LVDS_BKLT_EN PEG_RX8- PEG_TX8- GND (FIXED) GND (FIXED) GND (FIXED) GND (FIXED) LVDS_A_CK+...
- Page 48 COM Express Module Pinout Definitions Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com.
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Page 49: Appendix B: System Resources
SYSTEM RESOURCES PCI resource allocation Slot / Device signal Slot / Device 0 Slot / Device 1 Slot / Device 2 Slot / Device 3 IDSEL PCI_AD[20] PCI_AD[21] PCI_AD[22] PCI_AD[23] PCI Clock PCI_CLK replica PCI_CLK replica PCI_CLK replica PCI_CLK replica INTA# PCI_IRQ[A]# PCI_IRQ[B]#... -
Page 50: Bios Organization And System Memory Map
3. 00 10 00 00 = 1-3-1-1 beeps Note: Only standard Phoenix TrustedCore BIOS POST 80 codes are listed in the tables below. If you encounter other POST 80 codes, contact RadiSys for further assistance. Arrow.com. Arrow.com. - Page 51 POST 80 codes First BIOS notebook (Pro) checkpoint codes Checkpoint Code Description IPMI Initialization. Verifies that CPU is in real mode from cold start. Disables NMIs. Gets CPU type from CPU registers. Miscellaneous hardware initialization. Disables system ROM shadow and start to execute from the flash device. Initializes chipset registers to power-on defaults.
- Page 52 System Resources Checkpoint Code Description Verifies the hardware configuration and notes whether the system has color or monochrome video. Initializes the Plug and Play, and PCI. Initializes the video device. Initializes QuietBoot (splash screen). Shadows video BIOS ROM. Displays the copyright message. Allocates storage for Multiboot tables.
- Page 53 POST 80 codes Checkpoint Code Description Creates MP tables. Tests CDROM. Exits big real mode. Fixes up the MP table physical pointer and checksum. Configures non-PC-compatible Plug and Play ISA devices, PCI IRQs, enable PCI devices and ROM-scan. Checks SMART status. Late SMM (system memory mode) initialization.
- Page 54 System Resources Checkpoint Code Description Initializes BIOS stack space for runtime usage. Finds space for memory WAD and zero it. Gets the CPU brand string. Boot block checkpoint codes Checkpoint Code Description 080h Chipset initialization. 081h Bridge initialization. 082h CPU initialization. 083h System timer initialization.
- Page 55 POST 80 codes Intel memory initialization checkpoint codes Checkpoint Code Description Detects GMCH device. Progress meter inside routine: DDRProgRCOMP Progress meter inside routine: DDRProgRCOMP Progress meter inside routine: DDRProgRCOMP Progress meter inside routine: DDRProgRCOMP Progress meter inside routine: DDRProgRCOMP Progress meter inside routine: DDRProgRCOMP Progress meter inside routine: DDRProgRCOMP Begin Common Initialization.
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Page 56: Error Message Codes
System Resources Error message codes Once the video is enabled, errors or warnings are sent to the video display as text messages shown in this table. Note: These messages are always displayed unless the board is configured for quiet boot or headless operation. - Page 57 Error message codes Class Number Name I/O errors 2E0h ERR_IO_ADDRESS 2E1h ERR_IO_COM 2E2h ERR_IO_LPT 2E3h ERR_IO_CONFLICT 2E4h ERR_IO_UNSUPPORTED 2E5h ERR_IO_IRQ 2E6h ERR_IO_IDE 2E7h ERR_IO_FDD 2F0h ERR_OTHER_CPUID 2F1h ERR_OTHER_BIST 2F2h ERR_OTHER_BSP 2F3h ERR_OTHER_AP 2F4h ERR_OTHER_CMOS 2F5h ERR_OTHER_DMA 2F6h ERR_OTHER_NMI 2F7h ERR_OTHER_FAILSAFE APPENDIX B: Arrow.com.
- Page 58 System Resources Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com.
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Page 59: Appendix C: Industry Standard References
INDUSTRY STANDARD REFERENCES Specification Description Location Processor Intel Pentium M processor http://developer.intel.com/design/intarch/pentiumm/pentiumm.htm Intel Celeron M processor http://developer.intel.com/design/intarch/celeronm/celeronm.htm Chipset Mobile Intel 915GM Express chipset http://www.intel.com/products/notebook/chipsets/915gm/915gm- overview.htm Mobile Intel 915GME Express chipset http://www.intel.com/products/embedded/chipsets_resources.htm Intel Communications I/O Hub (ICH6-M) http://www.intel.com/Assets/PDF/datasheet/301473.pdf COM Express PICMG COM Express Module Base www.picmg.org Specification Revision 1.0: PCI Industrial Computer Manufacturers Group, July 10, 2005...