Component Height Between Module And Carrier Board; Physical Interfaces - RadiSys PROCELERANT CE915GMA Product Manual

Procelerant ce915gm com express module

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Product Specifications

Component height between module and carrier board

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Parts mounted on the bottom surface of CE915GM modules (between the module and

the carrier board) have a maximum height of 3.8mm. This affects the maximum allowable

height of carrier board components underneath the module.

• If the carrier board has module-to-carrier interconnectors 5mm in height, the

clearance between the carrier board and the bottom surface of the module's PCB is

5mm. This limits the height of carrier board components underneath the module to

1mm.

• If the carrier board has module-to-carrier interconnectors 8mm in height, the

clearance between the carrier board and the bottom surface of the module's PCB is

8mm. This allows the use of carrier board components underneath the module up to

4mm in height.

DDR2 SO-DIMM slot

The 200-pin DDR2 SDRAM SO-DIMM memory slot complies with the JEDEC standard. For

pinout definitions, refer to the JEDEC DDR2 Specification at www.jedec.org.

Board-to-board interconnectors

The CE915GM board-to-board interconnector complies with the PICMG COM Express

Base Specification Version 1.0. For pinout definitions of the board-to-board

interconnector and required/optional features of COM Express pinout type 2, see

Appendix A, COM Express Module Pinout Definitions, on page

If you are designing a custom carrier board for CE915GM modules, refer to the Carrier

Board Design Guidelines for special notes.

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Procelerant ce915gm