Table Of Contents - RadiSys PROCELERANT CE915GMA Product Manual

Procelerant ce915gm com express module
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Preface................................................................................................................................................. 7
About this manual........................................................................................................................................7
What's new in this manual ...........................................................................................................................8
Safety notices ..............................................................................................................................................8
Electrostatic discharge......................................................................................................................................... 8
Where to get more product information .......................................................................................................8
Chapter 1: Product Overview ............................................................................................................ 9
Product codes............................................................................................................................................10
COM Express modules...................................................................................................................................... 10
System memory................................................................................................................................................. 10
Thermal options ................................................................................................................................................. 10
Module layout ............................................................................................................................................11
Chapter 2: Product Specifications .................................................................................................. 13
Mechanical ................................................................................................................................................13
Component height between module and carrier board...................................................................................... 16
Physical interfaces............................................................................................................................................. 16
Electrical ....................................................................................................................................................17
Module power consumption............................................................................................................................... 17
General Purpose I/O (GPIO) power consumption ............................................................................................. 20
Thermal design power ...............................................................................................................................21
Regulatory compliance ..............................................................................................................................21
Environmental compliance................................................................................................................................. 21
EMC compliance................................................................................................................................................ 22
Safety compliance ............................................................................................................................................. 22
Industry compliance........................................................................................................................................... 22
MTBF reliability prediction .........................................................................................................................22
Chapter 3: Hardware Reference ...................................................................................................... 23
General specifications ...............................................................................................................................23
Block diagram............................................................................................................................................24
Power supply .............................................................................................................................................25
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